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NEMIX RAM

NEMIX RAM 256GB (2x128GB) DDR4-3200 CL22 2Rx4 ECC Registered RDIMM Supermicro X12DPFR-AN6

SKU CH-TKM8-N7J7A

256 GB kit of two 128 GB DDR4-3200 registered ECC RDIMMs at CL22 and 1.2 V for Supermicro X12DPFR-AN6 servers

  • Capacity256GB (2 x 128GB)
  • Type288-Pin DDR4 RDIMM
  • SpeedDDR4 3200 (PC4 25600)
  • CAS LatencyCL22
  • Voltage1.20V
  • ECCYes
  • 256 GB total capacity from two 128 GB modules for dense server workloads
  • DDR4-3200 speed rated at PC4-25600 for high-throughput data paths
  • CL22 CAS latency at 1.2 V for efficient registered operation
  • ECC and registered design corrects single-bit errors and buffers every slot
  • Verified fit for Supermicro X12DPFR-AN6 motherboard with 288-pin RDIMM form factor

256GB DDR4-3200 ECC kit for Supermicro X12DPFR-AN6

This 256GB kit contains two 128GB DDR4-3200 Registered ECC RDIMMs built to the exact rank, voltage and timing the Supermicro X12DPFR-AN6 memory controller expects. The 2Rx4 organization and CL22 latency match the board's population rules so all slots are recognised at full capacity and rated speed. It is intended for administrators upgrading that specific server platform. Buyers who need UDIMM, SODIMM or non-ECC modules cannot use this kit.

Thermals noise and power draw in normal use

Each module operates at 1.2V without a heat spreader, relying on the server's directed airflow for cooling. Registered buffering reduces electrical load on the memory controller, keeping power draw predictable when all slots are populated. No active cooling or fan profiles are included, so acoustics depend entirely on the chassis fans already present in the system. The kit adds no additional noise sources of its own.

What the bundled accessories

The package supplies only the two 288-pin RDIMMs; no software, cables or mounting hardware are included. Installation follows the motherboard manual's approved DIMM population order, and the lifetime replacement warranty with US-based technical support covers the modules themselves. No configuration utilities or firmware updates are bundled, so the memory controller's default SPD settings handle initialization automatically.

Fordele

  • 256 GB total capacity from two 128 GB modules for dense server workloads
  • DDR4-3200 speed rated at PC4-25600 for high-throughput data paths
  • CL22 CAS latency at 1.2 V for efficient registered operation
  • ECC and registered design corrects single-bit errors and buffers every slot
  • Verified fit for Supermicro X12DPFR-AN6 motherboard with 288-pin RDIMM form factor

Specifikationer

BrandNEMIX RAM
SeriesNEMIX RAM Original Series Server Memory
ModelDDR4 ECC RDIMM Registered Server Memory
Part NumberMR25600-724K2
Capacity256GB (2 x 128GB)
Type288-Pin DDR4 RDIMM
SpeedDDR4 3200 (PC4 25600)
CAS LatencyCL22
Voltage1.20V
ECCYes
Buffered/RegisteredRegistered
Rank2Rx4
ChipsetMajor OEM Samsung, Micron, Hynix
Heat SpreaderNo
Compatible SystemSupermicro
FeaturesDDR4 ECC RDIMM Motherboard Compatible
Package Content256GB 2X128GB DDR4 3200MHz PC4-25600 2Rx4 1.2V 288-PIN ECC RDIMM KIT

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Spørgsmål om denne vare

How do I install these 288-pin DDR4 RDIMMs in the Supermicro X12DPFR-AN6, and what step is often missed?

Power down, open the chassis, and insert each module into the DIMM slots following the motherboard manual's population order for 2Rx4 registered DIMMs; the step often missed is verifying the exact slot sequence required for dual-channel operation with a two-module kit.

What maintenance or replacement will this 256GB ECC Registered kit need over time?

No routine maintenance is required for the modules themselves; ECC corrects single-bit errors on the fly, but if a DIMM develops uncorrectable errors the system will log them and the affected 128GB stick would need replacement under the lifetime warranty.

What limit appears first when this CL22 3200MHz kit runs sustained workloads?

The registered buffer adds one cycle of latency, so the CL22 timing at 1.20V becomes the bottleneck before thermal throttling, since these modules have no heat spreader and rely on chassis airflow to stay within JEDEC thermal limits.

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