NEMIX RAM 8GB DDR4 2933MHz CL21 1Rx8 1.2V 288-pin UDIMM memory upgrade
- 8GB
- 288-Pin DDR4 UDIMM
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NEMIX RAM
8GB DDR4-3200 UDIMM with CL22 timing and 1.2V operation, validated for Supermicro X12STE-F and X12STD-F motherboards
Size 8GB
This 8 GB DDR4 module is built to the precise specification required by the Supermicro X12STE-F and X12STD-F motherboards. It installs as a single 288-pin UDIMM running at 3200 MHz with CL22 latency and 1.2 V operation. The 1Rx8 rank structure matches the board's memory controller expectations for immediate recognition.
Without a heat spreader the module relies on case airflow, keeping acoustic output at zero while drawing only 1.20 V. Power consumption stays within the standard DDR4 envelope for this density and speed. The unbuffered non-ECC design adds no extra electrical load to the memory bus.
Major OEM chips from Samsung, Micron or Hynix are validated for continuous operation at 3200 MHz, CL22 and 1.2 V. Testing confirms the module holds its rated timing under prolonged workloads without throttling or errors. Builders needing ECC, registered DIMMs or higher capacities must select a different part.
| Brand | NEMIX RAM |
|---|---|
| Series | NEMIX RAM Original Series Memory |
| Model | DDR4 Non-ECC Unbuffered UDIMM Memory |
| Part Number | MD25600-818K1 |
| Capacity | 8GB |
| Type | 288-Pin DDR4 UDIMM |
| Speed | DDR4 3200 (PC4 25600) |
| CAS Latency | CL22 |
| Voltage | 1.20V |
| ECC | No |
| Buffered/Registered | Unbuffered |
| Rank | 1Rx8 |
| Chipset | Major OEM Samsung, Micron, Hynix |
| Heat Spreader | No |
| Compatible System | Supermicro |
| Features | DDR4 Non-ECC Unbuffered UDIMM Motherboard Compatible |
| Package Content | 8GB DDR4 3200MHz PC4-25600 1Rx8 1.2V 288-PIN Non-ECC UDIMM KIT |
Andre versioner af denne model
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Align the notch on the module with the key in the DDR4 slot, press down firmly until both retention clips click, then follow the motherboard manual's population sequence for 1Rx8 DIMMs to ensure the board recognises the full 8 GB at 3200 MHz.
No firmware updates are needed for the DRAM chips; the module is tested at 1.2 V CL22 and, once seated correctly, runs without further intervention unless the system is physically moved or the slot oxidises over years.
The bare PCB has no heat spreader, so sustained loads are limited by the module's own operating-temperature rating; if case airflow is insufficient the chips will throttle before the motherboard's VRM or CPU thermal limits are reached.
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