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Pink rectangular thermal pad 120 by 20 by 1.5 mm soft silicone finish

Thermal Grizzly

Thermal Grizzly Minus Pad 8 thermal pad 120 × 20 × 1.5 mm

SKU CH-1BHS-DV2ZR

Silicone thermal pad rated at 8.0 W/mK, sized 120 × 20 × 1.5 mm, electrically insulating and compressible for filling gaps between heatsinks and components

  • Thermal Conductivity8.0 W/mK
  • Long Term Operating Temperature-100 °C to +250 °C
  • FeaturesDescription: Thermal Grizzly Minus Pad is a thermal pad made

Option 20 x 120 x 1.5 mm

  • 0 W/mK conductivity transfers heat efficiently from GPU and CPU
  • 5 mm flexible silicone fills gaps between chip and heatsink
  • Self-adhesive pink pad applies with light pressure, no paste mess
  • Electrically insulating at 8 kV/mm protects components from shorts
  • Operating range -100 °C to +250 °C suits consoles and laptops

Target use

This thermal pad is designed for PC builders and console owners who need to bridge uneven gaps between a heat source and a heatsink where thermal paste cannot be applied. It suits laptops, desktops, and PlayStation or Xbox consoles requiring reliable heat transfer across irregular surfaces.

Critical specification

The pad delivers 8.0 W/mK thermal conductivity at a thickness of 1.5 mm, making conductivity and thickness the decisive figures for matching your specific gap tolerance. It operates continuously from -100 °C to +250 °C and carries a V-0 flammability rating with electrical insulation rated at 8 kV/mm.

Installation notes

The self-adhesive, Shore 00-60 silicone sheet is soft enough to conform with only light pressure, yet it can be trimmed to fit smaller components such as VRM arrays or memory modules. Because the material is compliant, over-tightening mounting screws may compress it beyond its optimal range, so secure the heatsink just enough to hold contact without excessive force.

Fordele

  • 0 W/mK conductivity transfers heat efficiently from GPU and CPU
  • 5 mm flexible silicone fills gaps between chip and heatsink
  • Self-adhesive pink pad applies with light pressure, no paste mess
  • Electrically insulating at 8 kV/mm protects components from shorts
  • Operating range -100 °C to +250 °C suits consoles and laptops

Specifikationer

BrandThermal Grizzly
SeriesMinus Pad 8
ModelTG-MP8-120-20-15 1R
Part NumberTG-MP8-120-20-15-1R
Thermal Conductivity8.0 W/mK
Long Term Operating Temperature-100 °C to +250 °C
FeaturesDescription: Thermal Grizzly Minus Pad is a thermal pad made from modified silicone. The silicone is filled with metal oxides, thus ensuring remarkable thermal conductivity.
Properties: The Thermal Grizzly Minus Pad 8 is a soft gap filler, which is adhesive but easy to remove. The Thermal Grizzly Minus Pad 8 is insulating and sports very high thermal conductivity, even with very little contact pressure.
Standard Colour: The colour is a red-brown.
Shipping: The Thermal Grizzly Minus Pad 8 is currently available for end users in the following sizes: 100mm x 100mm, 120mm x 20mm and 30mm

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Spørgsmål om denne vare

How much heat will the 8.0 W/mK rating actually move inside my laptop or console?

The 8.0 W/mK conductivity lets the pad transfer heat efficiently across the 120 × 20 mm area at 1.5 mm thickness, filling gaps between a chip and heatsink in laptops, PS5, Xbox Series X or MacBooks.

What does the Shore 00-60 hardness mean for installation and contact?

Shore 00-60 makes the pink silicone very soft and highly compressible, so light pressure creates full surface contact and conforms to uneven substrates without damaging delicate components.

Will the 120 × 20 × 1.5 mm sheet fit my GPU memory modules or M.2 drive heatsink?

The pad measures 120 mm long, 20 mm wide and 1.5 mm thick; it can be cut to smaller pieces for VRAM chips, VRM rows or an M.2 heatsink while keeping the same thermal performance.

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