Thermal Hero
Thermal Hero NEO thermal pad 120 x 20 mm 1.5 mm 12.0 W/mK
A 120 x 20 mm silicone thermal pad, 1.5 mm thick with 12.0 W/mK conductivity and 30 Shore softness for CPU, GPU and console cooling
- 0 W/mK conductivity transfers heat fast from CPU or GPU
- 30 Shore medium-soft pad compresses easily for beginners and experts
- 120 × 20 mm sheet fits large laptop or console gaps
- 5 mm thickness bridges uneven surfaces without excess bulk
- Non-conductive, non-toxic silicone meets RoHS and REACH standards
Thermal Hero NEO pad for CPU GPU console cooling
The Thermal Hero NEO thermal pad measures 120 by 20 millimetres with a 1.5 millimetre thickness. It is designed to transfer heat from CPUs, GPUs and other integrated circuits in PCs, laptops and gaming consoles. The pad suits enthusiasts who need reliable thermal interface material for high-performance components.
12.0 W/mK conductivity for high heat loads
Thermal conductivity reaches 12.0 W/mK, providing low thermal resistance for demanding cooling tasks. This level of conductivity supports overclocked processors and graphics cards that generate intense heat. The specification determines whether the pad meets the thermal budget of a specific application.
Medium soft 30 Shore pad compresses easily
A 30 Shore hardness makes the pad medium soft, allowing it to conform to uneven surfaces and fill microscopic gaps without excessive pressure. The material is non-conductive, non-toxic and resistant to corrosion or oxidation. Normal operation remains stable at elevated temperatures with no drying or pumping out.
Fordele
- 0 W/mK conductivity transfers heat fast from CPU or GPU
- 30 Shore medium-soft pad compresses easily for beginners and experts
- 120 × 20 mm sheet fits large laptop or console gaps
- 5 mm thickness bridges uneven surfaces without excess bulk
- Non-conductive, non-toxic silicone meets RoHS and REACH standards
Specifikationer
Der er endnu ikke offentliggjort specifikationer for denne vare.
Spørgsmål om denne vare
How does the 12.0 W/mK conductivity translate once the pad is installed?
The pad delivers up to 12.0 W/mK thermal conductivity with low thermal resistance, so heat moves efficiently from the chip to the heatsink once the 1.5 mm layer is compressed in place.
What interface standard governs the pad and what does it limit?
The pad uses a simple pressure-contact interface; its 30 Shore softness lets it conform to uneven surfaces and fill gaps, while the non-electrically-conductive silicone prevents shorts.
Will the 120 x 20 mm sheet with 1.5 mm thickness fit my GPU or console VRM area?
The pad measures 120 mm by 20 mm and is 1.5 mm thick, so it can be trimmed to cover VRM rows, memory chips or similar flat surfaces on graphics cards and consoles.
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