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Light blue square thermal pad, 100 by 100 by .5 mm, soft silicone sheet, non-conductive, 21 W/mK conductivity

UPSIREN

UPSIREN OEM 21W/mK Thermal Pad 100x100mm .5mm 23g

SKU CH-T1CR-57D4P

High-conductivity 21 W/mK silicone thermal pad measuring 100 × 100 × 0.5 mm, non-conductive and reusable for CPU, GPU and heatsink gaps

  • Volume / Net Weight23g
  • Thermal Conductivity21W/mk
  • Long Term Operating Temperature-40 to 200 C
  • FeaturesNon-Corrosive, Non-Curing & Non-Toxi

Option 100 x 100 x 0.5 mm

  • 21 W/mK thermal conductivity moves heat quickly from chip to heatsink
  • 100 × 100 × 0.5 mm pad covers large CPU or GPU surfaces
  • Soft 30 Shore hardness compresses to fill microscopic gaps without pressure damage
  • Non-conductive silicone insulates electrically while transferring heat safely
  • Rated −40 °C to 200 °C for long-term reliability in demanding environments

Thermal pad for chips and heatsinks

This UPSIREN OEM pad measures 100 by 100 millimetres and is 0.5 millimetres thick with a net weight of 23 grams. It provides a thermal conductivity of 21 W/mK and remains stable from minus 40 to 200 degrees Celsius. The silicone material is non-conductive, non-corrosive, non-curing and non-toxic.

Replaces messy paste on tight gaps

The pad fills the space between a heat-generating chip and its heatsink where liquid compound would be difficult to apply or would pump out over time. Its natural viscosity allows easy positioning and the pad can be removed and reused during maintenance. The jump is worth it when a clean, repeatable interface is preferred over reapplying grease.

Consistent under continuous heat

Rated for long-term operation across the full minus 40 to 200 degree Celsius range, the pad does not melt, cure or degrade with sustained load. Hardness of 30 degrees keeps it soft enough to maintain full contact while resisting permanent compression. Insulation properties stay intact so no electrical risk appears during extended use.

Fordele

  • 21 W/mK thermal conductivity moves heat quickly from chip to heatsink
  • 100 × 100 × 0.5 mm pad covers large CPU or GPU surfaces
  • Soft 30 Shore hardness compresses to fill microscopic gaps without pressure damage
  • Non-conductive silicone insulates electrically while transferring heat safely
  • Rated −40 °C to 200 °C for long-term reliability in demanding environments

Specifikationer

BrandUPSIREN
SeriesOEM
Model21W
Volume / Net Weight23g
Thermal Conductivity21W/mk
Long Term Operating Temperature-40 to 200 C
FeaturesNon-Corrosive, Non-Curing & Non-Toxi

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Spørgsmål om denne vare

Will the 100x100mm pad cover my GPU memory modules?

The pad measures 100 by 100 millimetres; cut it to the exact shape needed for each module or VRM area.

How do I install the .5mm pad without trapping air bubbles?

Clean both surfaces, peel the protective film, lay the pad down evenly and press the heatsink straight down — do not slide it.

When should I replace the 21W/mK pad?

Replace it if the silicone hardens, cracks or loses its natural viscosity after repeated thermal cycles.

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