NEMIX RAM DDR5-5600 2TB (16x128GB) ECC RDIMM CL46 1.1V Supermicro H14SST-G memory upgrade
- 2TB (16 x 128GB)
- 288-Pin DDR5 RDIMM
Me võtame vastu krüptoraha — nii saab teie hoitav krüptoraha osta päris riistvara.Makske krüptorahaga, kulutage seda päris riistvarale. Tasuta kindlustatud tarne kogu maailmas, üle 399 $. Lihtsad, kaubamärgita väliskarbid, saadetud Saksamaalt.Tasuta kindlustatud tarne üle 399 $. Teie kurss lukustatakse 30 minutiks kohe, kui kassa avaneb.Kurss lukustatud 30 minutiks. Iga toode on pitseeritud, selle seerianumber on kontrollitud ja sellel kehtib 24-kuuline garantii.Pitseeritud, 24-kuulise garantiiga.
DELL
Replacement system board for Latitude E5570 with integrated Intel i3-6100U 2.3GHz dual-core processor and UMA graphics, no USB-C port
This genuine Dell OEM motherboard carries the part number MJJCK and ships with an on-board Intel Core i3-6100U processor running at 2.3 GHz. It is built as a direct replacement for Latitude E5570 laptops that use integrated Intel UMA graphics and a dual-core CPU without the optional USB-C port. Repair technicians and IT departments can install it to restore a matching configuration.
The board relies on the laptop's existing cooling assembly to dissipate heat from the soldered 2.3 GHz dual-core processor and integrated graphics. Because the CPU and GPU share the same thermal solution, fan behaviour and acoustic output remain consistent with the original system design under typical workloads. Power consumption follows the standard profile for this UMA platform.
Dell OEM construction uses the same board layout and mounting points as the factory unit, so it aligns with the E5570 chassis screw bosses and flex-cable routing. The absence of a USB-C port means the left-side I/O cut-out matches the non-USB-C variant exactly. All display, USB-A, Ethernet and docking connectors retain their original positions for a straightforward swap.
| Brand | DELL |
|---|
Remove the battery first, then disconnect all cables and screws holding the old board; the step many miss is re-seating the CPU thermal pad and re-applying paste before locking the heatsink down.
The processor is soldered to the board, so it cannot be replaced separately; plan on cleaning the fan and heatsink annually and replacing the thermal paste if temperatures rise.
The shared system memory becomes the bottleneck, capping graphics performance once the dual-core CPU saturates the available bandwidth.
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Sama osakond, sama kassa — kaheksa krüptovaluutat ja 30-minutiline kursilukk.
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