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Seuratut tuotteet Kirjaudu sisään
Green micro-ATX motherboard with LGA 1151 socket and DDR3 slots

ASUS

ASUS H110M-E D3 Intel H110 DDR3 32GB Micro ATX motherboard

SKU CH-EYJT-Y8YJR

Micro ATX board with LGA 1151 socket and Intel H110 chipset supporting up to 32 GB DDR3 memory

  • CPU Socket TypeLGA 1151
  • ChipsetIntel H110
  • Maximum Memory Supported32GB
  • Supports up to 32 GB DDR3 memory
  • LGA 1151 socket fits compatible Intel CPUs
  • Intel H110 chipset provides essential platform features
  • Micro ATX form factor suits compact builds
  • Includes SATA cable for storage connectivity

Socket and chipset

This ASUS H110M-E D3 motherboard uses the Intel H110 chipset and an LGA 1151 socket. It accepts DDR3 memory up to a maximum of 32 GB. The Micro ATX form factor fits smaller chassis builds.

Included accessories

The package contains the motherboard, one SATA cable, a chassis I/O back panel and a metal battery. No original packaging or additional cables are supplied. The board arrives without retail boxing.

Capacity and limits

Memory capacity tops out at 32 GB of DDR3, which covers everyday office and light multitasking workloads. Heavier content creation or virtualisation tasks will exceed this headroom. The single SATA cable supports one drive connection out of the box. Buyers needing more storage ports or faster memory standards should look elsewhere.

Kohokohdat

  • Supports up to 32 GB DDR3 memory
  • LGA 1151 socket fits compatible Intel CPUs
  • Intel H110 chipset provides essential platform features
  • Micro ATX form factor suits compact builds
  • Includes SATA cable for storage connectivity

Tekniset tiedot

BrandASUS
ModelASUS H110M-E D3
CPU Socket TypeLGA 1151
ChipsetIntel H110
Maximum Memory Supported32GB

Kysymyksiä tästä tuotteesta

Will the DDR3 memory slots or the LGA 1151 socket need replacement under normal use?

The DDR3 slots and LGA 1151 socket are soldered to the board and are not user-replaceable parts. If either fails the motherboard would need to be swapped.

What limit appears first when the Intel H110 chipset runs sustained heavy loads?

The chipset heatsink is the first thermal bottleneck during prolonged high-throughput I/O because the H110 has no active cooling of its own.

How much fan noise and heat should I expect from the board itself during all-day operation?

The motherboard produces no noise of its own; only the CPU cooler and case fans generate sound. Chipset heat stays low with modest case airflow.

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