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Seuratut tuotteet Kirjaudu sisään
Black ATX motherboard with silver heatsinks and PCIe slots

GIGABYTE

GIGABYTE B550 GAMING X V2 AM4 ATX AMD motherboard 128GB DDR4 4733MHz

SKU CH-T86W-REBDM MPN B550 GAMING X V2

ATX board for AM4 Ryzen 5000 and 3000 CPUs with dual-channel DDR4 up to 128 GB, PCIe 4.0 x16 and dual NVMe M.2 slots

  • CPU Socket TypeAM4
  • CPU TypeSupport AMD Ryzen 5000 / 5000 G / 4000 G / 3000 Series Proce
  • ChipsetAMD B550
  • Number of Memory Slots4x288pin (DDR4)
  • Memory StandardDDR4 4733(OC) / 4600(OC) / 4400(OC) / 4266(OC) / 4133(OC) /
  • Maximum Memory Supported128GB

Option B550 GAMING X V2

  • B550 GAMING X V2
  • B550 AORUS ELITE
  • B550 AORUS ELITE V2
  • B550 AORUS ELITE AX V2
  • B550 AORUS MASTER
  • B550 AORUS PRO
  • B550 AORUS PRO AC
  • B550 GAMING X
  • B550M AORUS PRO
  • B550M DS3H
  • B550M K
  • B550 UD AC
Näytä 5 muuta kokoonpanoa

Yliviivatut versiot ovat olemassa, mutta niitä ei ole varastossa täällä.

  • Supports AMD Ryzen 5000, 4000 G and 3000 series CPUs via AM4 socket
  • 10+3 phase digital twin power design with low RDS(on) MOSFETs for stable delivery
  • PCIe 4.0 x16 slot and dual M.2 connectors for NVMe SSDs up to 22110
  • Four DDR4 slots up to 4733 OC with 128 GB maximum capacity
  • GIGABYTE 8118 gaming LAN, USB 3.2 Gen1 Type-C and HDMI plus DVI-D outputs

AMD Ryzen 5000 Ready ATX Foundation

The GIGABYTE B550 GAMING X V2 is an ATX motherboard built for AMD Ryzen 5000, 5000 G, 4000 G and 3000 series processors on the AM4 socket. It uses the AMD B550 chipset to deliver PCIe 4.0 connectivity for graphics and storage. Four 288-pin DDR4 slots support up to 128GB of memory in dual-channel mode.

10+3 Phase Digital Power With Enlarged Heatsink

A 10+3 phase digital twin power design uses low RDS(on) MOSFETs to supply the CPU efficiently. An enlarged heatsink covers the VRM area to dissipate heat during sustained loads. The board draws power through standard ATX and 8-pin EPS connectors without requiring exotic cooling.

Dual M.2 NVMe And Front USB 3.2 Gen1 Type-C

Two M.2 slots accept 2242, 2260, 2280 and 22110 SSDs with PCIe 4.0 or 3.0 x4 speeds depending on the CPU installed. Four SATA 6Gb/s ports remain available for additional drives. Front-panel USB 3.2 Gen1 Type-C, HDMI and DVI-D outputs simplify case wiring and multi-display setups.

Kohokohdat

  • Supports AMD Ryzen 5000, 4000 G and 3000 series CPUs via AM4 socket
  • 10+3 phase digital twin power design with low RDS(on) MOSFETs for stable delivery
  • PCIe 4.0 x16 slot and dual M.2 connectors for NVMe SSDs up to 22110
  • Four DDR4 slots up to 4733 OC with 128 GB maximum capacity
  • GIGABYTE 8118 gaming LAN, USB 3.2 Gen1 Type-C and HDMI plus DVI-D outputs

Tekniset tiedot

BrandGIGABYTE
ModelB550 GAMING X V2
CPU Socket TypeAM4
CPU TypeSupport AMD Ryzen 5000 / 5000 G / 4000 G / 3000 Series Processors
ChipsetAMD B550
Number of Memory Slots4x288pin (DDR4)
Memory StandardDDR4 4733(OC) / 4600(OC) / 4400(OC) / 4266(OC) / 4133(OC) / 4000(OC) / 3866(OC) / 3733(OC) / 3600(OC) / 3466(OC) / 3400(OC) / 3200 / 2933 / 2667 / 2400 / 2133
Maximum Memory Supported128GB
Channel SupportedDual Channel
Memory Performance ProfileIntel XMP 2.0
ECC SupportedECC memory (ECC mode) support varies by CPU
Buffer SupportedUn-buffered
PCI Express 4.0 x161 x PCI Express 4.0 x16*
* Actual support may vary by CPU.
* For optimum performance, if only one PCI Express graphics card is to be installed, be sure to install it in the PCIEX16 slot.
PCI Express 3.0 x161 x PCI Express 3.0 x16*
* Supporting PCIe 3.0 x2 mode.
PCI Express x161 x PCI Express x16
PCI Express x13 x PCI Express 3.0 x1
PCI Slots2 x PCI Slots
Serial ATA (SATA)4 x SATA 6Gb/s
M.21 x M.2 connector (M2A_CPU), integrated in the CPU, supporting Socket 3, M key, type 2242/2260/2280/22110 SSDs:
AMD Ryzen 5000 Series and Ryzen 3000 Series Processors support SATA and PCIe 4.0 x4/x2 SSDs
AMD Ryzen Ryzen 5000 G-Series and Ryzen 4000 G-Series Processors support SATA and PCIe 3.0 x4/x2 SSDs
1 x M.2 connector (M2B_SB), integrated in the Chipset, supporting Socket 3, M key, type 2242/2260/2280/22110 SSDs:
Supporting SATA and PCIe 3.0 x4/x2 SSDs
SATA RAID0/1/10
Onboard Video ChipsetSupported only by CPU with integrated graphic
Audio ChipsetRealtek Audio CODEC
Audio Channels7.1 Channels
LAN ChipsetRealtek GbE LAN chip
Max LAN Speed1Gbps
Back I/O Ports2 x USB 2.0/1.1 ports
1 x PS/2 keyboard/mouse port
1 x DVI-D port
1 x HDMI port
3 x USB 3.2 Gen 1 ports
1 x USB 3.2 Gen 2 Type-A port (red)
1 x Q-Flash Plus button
1 x RJ-45 port
3 x audio jacks
USB 3.02 x USB 3.0
Onboard USB1 x USB Type-C port, with USB 3.2 Gen 1 support
1 x USB 3.2 Gen 1 header
2 x USB 2.0/1.1 headers
Other Connectors1 x CPU fan header
1 x water cooling CPU fan header
3 x system fan headers
2 x addressable LED strip headers
2 x RGB LED strip headers
1 x CPU cooler LED strip/RGB LED strip header
1 x front panel header
1 x front panel audio header
1 x Trusted Platform Module (TPM) header (2x6-pin, for the GC-TPM2.0_S module only)
1 x Clear CMOS jumper
Form FactorATX
LED LightingRGB
Dimensions (W x L)12.0" x 9.6"
Power Pin1 x 24-pin ATX main power connector
1 x 8-pin ATX 12V power connector
Windows 11Supported
FeaturesI/O Controller:
iTE I/O Controller Chip
H/W Monitoring:
Voltage detection
Temperature detection
Fan speed detection
Water cooling flow rate detection
Overheating warning
Fan fail warning
Fan speed control
* Whether the fan speed control function is supported will depend on the cooler you install.
BIOS:
1 x 256 Mbit flash
Use of licensed AMI UEFI BIOS
PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0
Unique Features:
Support for APP Center
* Available applications in APP Center may vary by motherboard model. Supported functions of each application may also vary depending on motherboar
Lähetyspaino1.52 kg
Pakkauksen mitat335 × 270 × 80 mm

Tämän mallin muut versiot

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Sama tuoteperhe, eri muisti, jäähdytin tai kellotaajuus — vertaile ennen päätöstä.

Kysymyksiä tästä tuotteesta

How do I install the CPU into the AM4 socket on this board, and what step is often missed?

Lift the retention arm, align the gold triangle on the Ryzen processor with the socket marker, lower the chip without force, then lock the arm down; the step often missed is removing the plastic socket cover before placement.

What maintenance or replacement will the board need later?

The primary item is the CMOS battery that keeps BIOS settings; when the system starts losing the date and time after being unplugged, replace that cell.

What limit appears first under sustained heavy load?

The 10+3 phase digital VRM and its heatsink set the practical thermal ceiling; prolonged all-core workloads on high-wattage Ryzen CPUs will hit VRM temperature limits before other components.

Myös tällä osastolla

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