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Seuratut tuotteet Kirjaudu sisään
Square Intel Core i7-8700 CPU, silver heat-spreader, gold LGA-1151 contact pads

Intel

Intel i7-8700Product desktop processor

SKU CH-GBR0-2TJDG MPN i7-8700Product

Hexa-core desktop processor reaching 4.30 GHz with 12 MB L3 cache and integrated graphics

  • NameCore i7-8700
  • Memory Channel2
  • Operating System SupportedWindows 11
  • Six cores at 3.2 GHz handle multi-tasking workloads smoothly
  • Turbo Boost 2.0 raises clocks to 4.3 GHz for peak single-thread speed
  • 12 MB L3 cache keeps frequent data close to the cores
  • 65 W TDP allows cooler, quieter system builds
  • LGA 1151 socket fits compatible motherboards

Core i7-8700 hexa-core desktop processor

The Intel Core i7-8700 is a six-core desktop processor with a 3.20 GHz base clock and a 4.30 GHz Turbo Boost 2.0 frequency. It includes 12 MB of L3 cache and integrates Intel HD Graphics. The chip fits the LGA-1151 socket and carries a 65 W thermal design power. Windows 11 is supported.

Who this suits and who should look elsewhere

This processor suits builders upgrading an existing LGA-1151 platform or assembling a cost-effective system for general productivity and light gaming. Users who need higher core counts, unlocked multipliers or newer platform features should consider a different CPU.

The deciding specification

The LGA-1151 socket and 65 W TDP determine whether this processor fits your motherboard and cooling solution. Verify that your board supports 8th-generation Core i7 CPUs before purchase.

Kohokohdat

  • Six cores at 3.2 GHz handle multi-tasking workloads smoothly
  • Turbo Boost 2.0 raises clocks to 4.3 GHz for peak single-thread speed
  • 12 MB L3 cache keeps frequent data close to the cores
  • 65 W TDP allows cooler, quieter system builds
  • LGA 1151 socket fits compatible motherboards

Tekniset tiedot

NameCore i7-8700
Memory Channel2
Operating System SupportedWindows 11

Kysymyksiä tästä tuotteesta

How is the LGA-1151 processor seated, and which step is often missed?

Align the notches on the chip with the socket keys, lower it straight down without force, then close the retention lever until it clicks; the step most often missed is removing the plastic socket cover before placement.

What component will need replacement after several years of continuous operation?

The thermal paste between the heat spreader and cooler dries out over time; plan to clean the old compound and apply a fresh layer when temperatures rise noticeably.

At what power level does the 65 W thermal design limit throttle sustained all-core workloads?

When the six cores hold turbo near 4.30 GHz the package hits the 65 W ceiling, so the firmware reduces frequency to stay within that thermal envelope.

Myös tällä osastolla

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