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Intel Xeon Platinum 8450H server CPU in LGA 4677 package

Intel

Intel PK8071305075901 Xeon Platinum 8450H server processor 28-core 2.0 GHz 75MB L3 250W LGA 4677

SKU CH-2KBB-J25A4 MPN PK8071305075901

28-core server processor with 56 threads, 75MB L3 cache, 2.0 GHz base and 3.5 GHz turbo, supporting DDR5-4800 memory up to 4TB across eight channels in an LGA 4677 socket with PCIe 5.0 and 250W TDP

  • NameXeon Platinum 8450H
  • CPU Socket TypeLGA 4677
  • Core NameSapphire Rapids
  • # of Cores28-Core
  • # of Threads56
  • Operating Frequency2.0 GHz
  • 28 cores and 56 threads handle heavy parallel workloads
  • 0 GHz base up to 3.5 GHz turbo adapts to burst demand
  • 75 MB L3 cache keeps large data sets close to cores
  • 8-channel DDR5 up to 4800 MT/s feeds memory-hungry applications
  • PCIe 5.0 with 80 lanes provides high-throughput I/O for storage and accelerators

28-Core Xeon for dense servers

The Intel Xeon Platinum 8450H delivers 28 cores and 56 threads in a LGA 4677 package built for multi-socket platforms. Its 2.0 GHz base frequency scales to 3.5 GHz turbo when thermal headroom allows. The 75 MB L3 cache feeds data to all cores without leaving the die. This processor targets high-density compute nodes where core count per socket drives licensing and rack efficiency.

250 W TDP demands directed airflow

At 250 W thermal design power the chip moves significant heat under sustained loads and requires server-grade heatsinks with high-static-pressure fans. No cooling device is included in the box. Eight-channel DDR5 support at up to 4800 MT/s per DIMM adds memory-subsystem power that the platform cooling must also dissipate. Acoustic output will follow the chassis fan curves configured for the target inlet temperature.

LGA 4677 socket and 80 PCIe 5.0 lanes

The flip-chip land-grid array seats in a keyed LGA 4677 socket with a dedicated retention mechanism; handling requires even pressure to avoid bent contacts. Eighty lanes of PCI Express 5.0 connect directly to the CPU for accelerators, storage controllers or high-speed networking without chipset bottlenecks. S8S scalability enables eight-socket configurations using Intel UPI links routed through the system board.

Kohokohdat

  • 28 cores and 56 threads handle heavy parallel workloads
  • 0 GHz base up to 3.5 GHz turbo adapts to burst demand
  • 75 MB L3 cache keeps large data sets close to cores
  • 8-channel DDR5 up to 4800 MT/s feeds memory-hungry applications
  • PCIe 5.0 with 80 lanes provides high-throughput I/O for storage and accelerators

Tekniset tiedot

BrandIntel
SeriesIntel Xeon Platinum
NameXeon Platinum 8450H
ModelPK8071305075901
CPU Socket TypeLGA 4677
Core NameSapphire Rapids
# of Cores28-Core
# of Threads56
Operating Frequency2.0 GHz
Max Turbo Frequency3.5 GHz
L3 Cache75MB
64-Bit SupportYes
Hyper-Threading SupportYes
Manufacturing Tech10 nm
Integrated Memory Controller SpeedUp to DDR5 4800 MT/s 1DPC
Up to DDR5 4400 MT/s 2DPC
Maximum Memory Capacity4TB
Memory Channel8 Channel
Virtualization Technology SupportYes
ScalabilityS8S
PCI Express Revision5.0
Max # of PCI Express Lanes80
Thermal Design Power250W
Cooling DeviceCooling device not included - Processor Only
Lähetyspaino0.23 kg
Pakkauksen mitat127 × 102 × 25 mm

Kysymyksiä tästä tuotteesta

How do I install the Xeon Platinum 8450H into an LGA 4677 socket without bending pins?

Align the processor triangle marker with the socket corner, lower it vertically without force, then secure the retention lever fully; the step most often missed is verifying the load-plate sits flush before locking.

What maintenance or replacement will the 250 W Xeon Platinum 8450H require over its service life?

The processor itself has no user-serviceable parts; plan to replace thermal interface material every two to three years and ensure the chosen heatsink or liquid cold plate is rated for 250 W continuous dissipation.

At what point does the 250 W thermal design power become the limiting factor during sustained all-core workloads?

When all 28 cores run near 3.5 GHz turbo, package power hits 250 W; if the cooling solution cannot move that heat, the processor will throttle frequency to stay within its thermal envelope.

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