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NEMIX RAM
NEMIX RAM 32GB DDR4 2666 ECC LRDIMM 2Rx4 CL19 1.2V 288-Pin HPE DL325 G10 memory upgrade
A 32 GB DDR4 2666 ECC LRDIMM module with CL19 latency and 1.2 V operation for HPE ProLiant DL325 G10 servers
- Capacity32GB
- SpeedDDR4 2666 (PC4 21300)
- ECCYes
- Buffered/RegisteredLoad Reduced
- ChipsetMajor OEM Samsung, Micron, Hynix
- Voltage1.20V
- 32 GB capacity expands server memory for heavy workloads
- DDR4 2666 speed matches HPE ProLiant DL325 G10 specifications
- ECC and load-reduced design protects data integrity in critical tasks
- 2 V operation reduces power draw per module
- 288-pin LRDIMM form factor fits compatible HPE server slots
32GB DDR4 2666 ECC LRDIMM for HPE DL325 G10
This 32GB DDR4 2666 ECC LRDIMM module is built for the HPE ProLiant DL325 G10 server. It uses a load-reduced design with 2Rx4 organisation to support high-density memory configurations. The 288-pin form factor operates at 1.2V with a CAS latency of CL19. IT teams select this part when expanding capacity in compatible HPE platforms.
Sustained load behaviour with load-reduced ECC
The load-reduced architecture lowers electrical loading on the memory bus, helping signal integrity when all slots are populated. ECC circuitry detects and corrects single-bit errors during continuous operation. Modules are stress tested under load before shipping to verify stability in multi-threaded server workloads. The 1.2V operating voltage keeps power draw consistent across extended duty cycles.
Verify slot count and population rules before
Confirm the DL325 G10 has an available 288-pin DDR4 LRDIMM slot and that the planned configuration follows HPE population guidelines for load-reduced modules. Mixing LRDIMM with standard RDIMM or UDIMM types is not supported. Check the server documentation for maximum total capacity and supported rank combinations per channel. BIOS version may affect recognition of 32GB density modules.
Kohokohdat
- 32 GB capacity expands server memory for heavy workloads
- DDR4 2666 speed matches HPE ProLiant DL325 G10 specifications
- ECC and load-reduced design protects data integrity in critical tasks
- 2 V operation reduces power draw per module
- 288-pin LRDIMM form factor fits compatible HPE server slots
Tekniset tiedot
| Brand | NEMIX RAM |
|---|---|
| Series | HPE Server/Workstation Compatible Series Memory |
| Model | HPE DDR4 2666MHZ ECC LRDIMM Load Reduced Server Memory |
| Part Number | ML21300-324K1 |
| Capacity | 32GB |
| Speed | DDR4 2666 (PC4 21300) |
| ECC | Yes |
| Buffered/Registered | Load Reduced |
| Chipset | Major OEM Samsung, Micron, Hynix |
| Voltage | 1.20V |
| Compatible System | HPE |
| CAS Latency | CL19 |
| Heat Spreader | No |
| Type | 288-Pin DDR4 LRDIMM |
| Rank | 2Rx4 |
| Features | DDR4 ECC LRDIMM Load Reduced Server Motherboard Compatible |
| Package Content | 32GB (1X32GB) DDR4 2666MHZ PC4-21300 2Rx4 1.2V CL19 288-PIN ECC LRDIMM Load Reduced Server Memory |
Kysymyksiä tästä tuotteesta
How much power does the 1.2V DDR4 2666 LRDIMM draw under continuous server load?
The module operates at 1.2V, which is standard DDR4 voltage; actual power draw depends on the HPE ProLiant DL325 G10 platform and workload, not the DIMM alone.
What must the HPE ProLiant DL325 G10 already have for this 288-pin ECC LRDIMM to function?
The server must support DDR4 2666 LRDIMM memory, have an available 288-pin DIMM slot, and run a BIOS that recognises 2Rx4 ECC LRDIMM modules.
Will this CL19 2Rx4 LRDIMM run at 2666 MHz alongside slower DDR4 DIMMs already installed in the DL325 G10?
The module is rated DDR4 2666 CL19; the system will clock all installed DIMMs to the lowest common speed and latency supported by the platform.
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