Lirealar 85x45mm thermal pad 12.8 W/mK 1.5mm 15g
- 15g
- 12.8 W/mK,
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Lirealar
Grey silicone pad measuring 120 by 20 by 2.0 millimetres conducts heat at 12.8 W/mK and insulates electrically up to 9.8 kilovolts
Type Thermal Pad
Precrtane verzije postoje, ali nisu dostupne ovdje.
This silicone thermal pad provides a 12.8 W/mK conductivity rating for transferring heat between components and heatsinks. It measures 120 by 20 by 2.0 mm and weighs 15 g. The grey pad is non-conductive, non-corrosive and non-curing. It suits laptops, GPUs, CPUs and LED coolers.
The material operates continuously from minus 40 °C to plus 200 °C, with a long-term rating up to 400 °C. Breakdown voltage exceeds 9.8 kV at 1 mm thickness. Density is 3.1 ± 0.2 g/cc and hardness ranges from 30 to 55 on the Shore C scale. Performance depends on full surface contact and correct thickness matching.
Natural viscosity lets the pad adhere during assembly and allows repositioning or reuse. Cut the single sheet to the exact component footprint before placement. Common problems include trapping air bubbles, leaving gaps on uneven surfaces or selecting the wrong thickness for the stack height. Ensure mating surfaces are clean and flat.
| Series | Thermal Pad |
|---|---|
| Model | 120x20x2.0mm |
| Volume / Net Weight | 15g |
| Thermal Conductivity | 12.8 W/mK, |
| Long Term Operating Temperature | -40 C to +400C |
| Specifications | Color:Gray Thermal Conductivity:12.8W/M-K Density:3.1±0.2g/cc Hardness:30-55(Sc) Breakdown Voltage:>9.8KV(1mm) Temperature Range:-40°C~200°C |
| Features | Non-Elecnical Conducive Non-Corrosive, Non-Curing & Non-Toxi One Pad , multi-purpose, durable,insulated, non-conductive lnsulation does not conduct electricity and is safe for use Natural viscosity, easy to assemble and reusable |
Druge verzije ovog modela
Ista obitelj, različita memorija, hladnjak ili frekvencija — usporedite prije kupnje.
The pad measures 120x20mm and is 2.0mm thick; select this size only if the gap between your GPU die and heatsink matches that height.
A conductivity of 12.8 W/mK moves heat from the die to the heatsink far faster than standard pads, lowering junction temperatures under load.
Yes — breakdown voltage exceeds 9.8KV at 1mm and the material is non-conductive, so it insulates nearby components while transferring heat.
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