Lirealar 120x20mm Thermal Pad 12.8 W/mK 2.0mm 15g
- 15g
- 12.8 W/mK,
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Lirealar
A 120x20x1.0mm silicone thermal pad rated at 12.8 W/mK conductivity, electrically non-conductive and usable from -40°C to 200°C
Type Thermal Pad
The Lirealar thermal pad measures 120x20mm with a 1.0mm thickness and provides 12.8 W/mK thermal conductivity. It is intended for builders and technicians who need a high-conductivity interface for laptop heatsinks, GPU modules, CPU packages or LED coolers.
The grey silicone pad weighs 15g and has a density of 3.1±0.2g/cc with hardness rated 30-55 Shore C. It is non-conductive, non-corrosive, non-curing and non-toxic, with a breakdown voltage above 9.8kV at 1mm thickness. Natural viscosity allows easy placement and reuse while insulating components safely across a -40°C to +200°C operating range.
The package supplies a single multi-purpose pad that fills gaps between uneven surfaces and rough textures without additional compounds. Its compressible elasticity bridges air gaps to lower contact thermal resistance, and the material resists wear, fire and metal damage while remaining reusable for future maintenance.
| Series | Thermal Pad |
|---|---|
| Model | 120x20x1.0mm |
| Volume / Net Weight | 15g |
| Thermal Conductivity | 12.8 W/mK, |
| Long Term Operating Temperature | -40 C to +400C |
| Specifications | Color:Gray Thermal Conductivity:12.8W/M-K Density:3.1±0.2g/cc Hardness:30-55(Sc) Breakdown Voltage:>9.8KV(1mm) Temperature Range:-40°C~200°C |
| Features | Non-Elecnical Conducive Non-Corrosive, Non-Curing & Non-Toxi One Pad , multi-purpose, durable,insulated, non-conductive lnsulation does not conduct electricity and is safe for use Natural viscosity, easy to assemble and reusable |
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The 12.8 W/mK rating indicates high thermal conductivity for a silicone pad, efficiently filling microscopic air gaps between the GPU die and heatsink to lower contact resistance and improve heat flow.
The pad measures 120 mm by 20 mm with a 1.0 mm thickness; its 30-55 Shore C hardness provides enough compliance to conform to uneven surfaces while maintaining structural integrity during assembly.
Clean both surfaces with isopropyl alcohol, peel the protective film, align the 120x20 mm pad over the chip, and apply even pressure — do not stretch the 1.0 mm thick silicone during placement.
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