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Lirealar

Lirealar 120x20mm 12.8 W/mK thermal pad 1.0mm 15g

SKU CH-8X79-9KS8P MPN 120x20mm

A 120x20x1.0mm silicone thermal pad rated at 12.8 W/mK conductivity, electrically non-conductive and usable from -40°C to 200°C

  • Volume / Net Weight15g
  • Thermal Conductivity12.8 W/mK,
  • Long Term Operating Temperature-40 C to +400C
  • SpecificationsColor:Gray Thermal Conductivity:12.8W/M-K Density:3.1±0.2g/c
  • FeaturesNon-Elecnical Conducive Non-Corrosive, Non-Curing & Non-Toxi

Type Thermal Pad

Model 120x20mm

Przekreślone wersje istnieją, ale nie są dostępne w tym miejscu.

Specification 1.0mm

Pokaż jeszcze 1 konfiguracji
  • High thermal conductivity of 12.8 W/mK for efficient heat transfer
  • Non-conductive insulation prevents electrical short circuits on sensitive components
  • Operates reliably from -40 °C to 200 °C for long-term stability
  • Soft 30–55 Shore C hardness conforms to uneven surfaces and fills air gaps
  • Reusable pad with natural viscosity allows easy installation and rework

Product Identity

The Lirealar thermal pad measures 120x20mm with a 1.0mm thickness and provides 12.8 W/mK thermal conductivity. It is intended for builders and technicians who need a high-conductivity interface for laptop heatsinks, GPU modules, CPU packages or LED coolers.

Build Quality & Mounting

The grey silicone pad weighs 15g and has a density of 3.1±0.2g/cc with hardness rated 30-55 Shore C. It is non-conductive, non-corrosive, non-curing and non-toxic, with a breakdown voltage above 9.8kV at 1mm thickness. Natural viscosity allows easy placement and reuse while insulating components safely across a -40°C to +200°C operating range.

Accessories & Software Impact

The package supplies a single multi-purpose pad that fills gaps between uneven surfaces and rough textures without additional compounds. Its compressible elasticity bridges air gaps to lower contact thermal resistance, and the material resists wear, fire and metal damage while remaining reusable for future maintenance.

Najważniejsze cechy

  • High thermal conductivity of 12.8 W/mK for efficient heat transfer
  • Non-conductive insulation prevents electrical short circuits on sensitive components
  • Operates reliably from -40 °C to 200 °C for long-term stability
  • Soft 30–55 Shore C hardness conforms to uneven surfaces and fills air gaps
  • Reusable pad with natural viscosity allows easy installation and rework

Specyfikacja

SeriesThermal Pad
Model120x20x1.0mm
Volume / Net Weight15g
Thermal Conductivity12.8 W/mK,
Long Term Operating Temperature-40 C to +400C
SpecificationsColor:Gray Thermal Conductivity:12.8W/M-K Density:3.1±0.2g/cc Hardness:30-55(Sc) Breakdown Voltage:>9.8KV(1mm) Temperature Range:-40°C~200°C
FeaturesNon-Elecnical Conducive Non-Corrosive, Non-Curing & Non-Toxi One Pad , multi-purpose, durable,insulated, non-conductive lnsulation does not conduct electricity and is safe for use Natural viscosity, easy to assemble and reusable

Inne wersje tego modelu

Jeszcze 5 w tej samej serii

Ta sama rodzina, inna pamięć, inne chłodzenie lub taktowanie — proszę porównać przed decyzją.

Pytania dotyczące tego produktu

What does the 12.8 W/mK thermal conductivity mean for heat transfer between a GPU and heatsink?

The 12.8 W/mK rating indicates high thermal conductivity for a silicone pad, efficiently filling microscopic air gaps between the GPU die and heatsink to lower contact resistance and improve heat flow.

Will the 120x20x1.0mm dimensions and 30-55 Shore C hardness fit my laptop GPU gap?

The pad measures 120 mm by 20 mm with a 1.0 mm thickness; its 30-55 Shore C hardness provides enough compliance to conform to uneven surfaces while maintaining structural integrity during assembly.

How do I install the pad correctly without tearing the 1.0mm material?

Clean both surfaces with isopropyl alcohol, peel the protective film, align the 120x20 mm pad over the chip, and apply even pressure — do not stretch the 1.0 mm thick silicone during placement.

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