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Small grey syringe of carbon-based thermal paste with applicator tool

Lirealar

Lirealar TF8 Thermal Paste 13.8 W/mK 2.0g

SKU CH-5CFH-S988G MPN TF8

High-conductivity carbon-based paste rated at 13.8 W/mK, non-conductive and non-corrosive, with a 2.0 g syringe and applicator for CPU and GPU cooling

  • Volume / Net Weight2.0g
  • Thermal Conductivity13.8 W/mK,
  • Long Term Operating Temperature-220~380°C
  • SpecificationsColor:Gray Thermal resistance:<0.01(°C-CM²/W) Density:2.9(25
  • FeaturesHigh Thermal Conductivity 13.8 W/mK Non-Elecnical Conducive

Type Thermal Paste

Model TF8

Przekreślone wersje istnieją, ale nie są dostępne w tym miejscu.

Specification 2g

Pokaż jeszcze 1 konfiguracji
  • High thermal conductivity of 13.8 W/mK moves heat efficiently from CPU and GPU
  • Non-electrically conductive carbon formula prevents short circuits on sensitive components
  • Non-corrosive, non-curing and non-toxic paste stays safe for long-term use
  • Easy-apply consistency fills microscopic gaps without voids even for first-time builders
  • Stable performance rated for at least six years without re-application needed

Carbon-based thermal compound

Lirealar TF8 is a carbon-based thermal compound with a rated conductivity of 13.8 W/mK. The 2.0 g syringe is intended for CPU, GPU and LED cooler interfaces on desktops and laptops. It is non-electrically conductive, non-corrosive and non-curing. The manufacturer states a service life of at least six years.

Who this suits and who it does not

Builders who need a non-conductive paste for standard processor and graphics card installations will find it straightforward to apply. Users who require a larger volume for multiple builds or a metal-based compound with higher conductivity should consider other options.

Thermal conductivity rating

The single figure that determines suitability is the 13.8 W/mK thermal conductivity. Match this value against the cooling requirement of your specific processor or graphics card before purchasing.

Najważniejsze cechy

  • High thermal conductivity of 13.8 W/mK moves heat efficiently from CPU and GPU
  • Non-electrically conductive carbon formula prevents short circuits on sensitive components
  • Non-corrosive, non-curing and non-toxic paste stays safe for long-term use
  • Easy-apply consistency fills microscopic gaps without voids even for first-time builders
  • Stable performance rated for at least six years without re-application needed

Specyfikacja

SeriesThermal Paste
ModelTF8 Thermal Compound Paste
Volume / Net Weight2.0g
Thermal Conductivity13.8 W/mK,
Long Term Operating Temperature-220~380°C
SpecificationsColor:Gray Thermal resistance:<0.01(°C-CM²/W) Density:2.9(25°C) Operating temperature:-220~380°C Electrical conductivity:NO Harmless:YES Content: 12.8g
FeaturesHigh Thermal Conductivity 13.8 W/mK Non-Elecnical Conducive Non-Corrosive, Non-Curing & Non-Toxi lnsulation does not conduct electricity and is safe for use It will last At least for 6 years

Inne wersje tego modelu

Jeszcze 5 w tej samej serii

Ta sama rodzina, inna pamięć, inne chłodzenie lub taktowanie — proszę porównać przed decyzją.

Pytania dotyczące tego produktu

Will the 13.8 W/mK TF8 paste work safely on an older CPU with a copper heat spreader?

Yes, the carbon-based compound is non-corrosive and non-electrically conductive, so it will not damage copper or aluminium surfaces on legacy processors.

How can I confirm the paste is performing correctly after I apply it?

Monitor CPU or GPU temperatures under load; the low thermal resistance below 0.01 °C-cm²/W and 13.8 W/mK conductivity should yield noticeably lower peak temps versus worn-out paste.

Does the 2.0 g syringe include a spreading tool, or must I buy one separately?

The retail pack ships with an application tool in the box, so no extra purchase is needed for installation.

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