Lirealar
Lirealar TF8 Thermal Paste 13.8 W/mK 2.0g
High-conductivity carbon-based paste rated at 13.8 W/mK, non-conductive and non-corrosive, with a 2.0 g syringe and applicator for CPU and GPU cooling
- Volume / Net Weight2.0g
- Thermal Conductivity13.8 W/mK,
- Long Term Operating Temperature-220~380°C
- SpecificationsColor:Gray Thermal resistance:<0.01(°C-CM²/W) Density:2.9(25
- FeaturesHigh Thermal Conductivity 13.8 W/mK Non-Elecnical Conducive
Type Thermal Paste
- Thermal Pad
- Thermal Paste
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- High thermal conductivity of 13.8 W/mK moves heat efficiently from CPU and GPU
- Non-electrically conductive carbon formula prevents short circuits on sensitive components
- Non-corrosive, non-curing and non-toxic paste stays safe for long-term use
- Easy-apply consistency fills microscopic gaps without voids even for first-time builders
- Stable performance rated for at least six years without re-application needed
Carbon-based thermal compound
Lirealar TF8 is a carbon-based thermal compound with a rated conductivity of 13.8 W/mK. The 2.0 g syringe is intended for CPU, GPU and LED cooler interfaces on desktops and laptops. It is non-electrically conductive, non-corrosive and non-curing. The manufacturer states a service life of at least six years.
Who this suits and who it does not
Builders who need a non-conductive paste for standard processor and graphics card installations will find it straightforward to apply. Users who require a larger volume for multiple builds or a metal-based compound with higher conductivity should consider other options.
Thermal conductivity rating
The single figure that determines suitability is the 13.8 W/mK thermal conductivity. Match this value against the cooling requirement of your specific processor or graphics card before purchasing.
Kohokohdat
- High thermal conductivity of 13.8 W/mK moves heat efficiently from CPU and GPU
- Non-electrically conductive carbon formula prevents short circuits on sensitive components
- Non-corrosive, non-curing and non-toxic paste stays safe for long-term use
- Easy-apply consistency fills microscopic gaps without voids even for first-time builders
- Stable performance rated for at least six years without re-application needed
Tekniset tiedot
| Series | Thermal Paste |
|---|---|
| Model | TF8 Thermal Compound Paste |
| Volume / Net Weight | 2.0g |
| Thermal Conductivity | 13.8 W/mK, |
| Long Term Operating Temperature | -220~380°C |
| Specifications | Color:Gray Thermal resistance:<0.01(°C-CM²/W) Density:2.9(25°C) Operating temperature:-220~380°C Electrical conductivity:NO Harmless:YES Content: 12.8g |
| Features | High Thermal Conductivity 13.8 W/mK Non-Elecnical Conducive Non-Corrosive, Non-Curing & Non-Toxi lnsulation does not conduct electricity and is safe for use It will last At least for 6 years |
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Kysymyksiä tästä tuotteesta
Will the 13.8 W/mK TF8 paste work safely on an older CPU with a copper heat spreader?
Yes, the carbon-based compound is non-corrosive and non-electrically conductive, so it will not damage copper or aluminium surfaces on legacy processors.
How can I confirm the paste is performing correctly after I apply it?
Monitor CPU or GPU temperatures under load; the low thermal resistance below 0.01 °C-cm²/W and 13.8 W/mK conductivity should yield noticeably lower peak temps versus worn-out paste.
Does the 2.0 g syringe include a spreading tool, or must I buy one separately?
The retail pack ships with an application tool in the box, so no extra purchase is needed for installation.
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