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Lirealar

Lirealar 120x20mm 12.8 W/mK thermal pad 0.5mm 15g

SKU CH-NB66-FTX70 MPN 120x20mm

A 120 x 20 x 0.5 mm silicone pad with 12.8 W/mK conductivity insulates and fills gaps between chips and heatsinks

  • Volume / Net Weight15g
  • Thermal Conductivity12.8 W/mK,
  • Long Term Operating Temperature-40 C to +400C
  • SpecificationsColor:Gray Thermal Conductivity:12.8W/M-K Density:3.1±0.2g/c
  • FeaturesNon-Elecnical Conducive Non-Corrosive, Non-Curing & Non-Toxi

Type Thermal Pad

Model 120x20mm

Przekreślone wersje istnieją, ale nie są dostępne w tym miejscu.

Specification 0.5mm

Pokaż jeszcze 1 konfiguracji
  • High 12.8 W/mK conductivity moves heat fast from chips
  • Non-conductive silicone insulates safely at up to 200 °C
  • Soft 30–55 Shore hardness fills uneven gaps without pressure damage
  • Thin 0.5 mm profile fits tight laptop and GPU spaces
  • Stable from –40 °C to +400 °C for long-term reliability

12.8 W/mK thermal pad for compact gaps

This 0.5 mm thick silicone pad measures 120 by 20 mm and weighs 15 g. It targets builders servicing laptops, graphics cards or small-form-factor boards where a thin, high-conductivity interface is required. The material is electrically non-conductive and non-corrosive, so it can sit directly on exposed circuitry without risk of shorts.

Fits tight spaces between die and heatsink

The pad compresses to fill uneven surfaces and microscopic air gaps that impede heat flow. Its operating range spans -40 °C to 200 °C, with a long-term rating to 400 °C, making it suitable for sustained loads on GPU memory modules or voltage-regulator zones. No curing time is needed; the natural tack holds position during assembly and allows rework if the heatsink is removed.

Single reusable pad simplifies maintenance

One 15 g piece covers the stated area without cutting multiple strips. The gray silicone resists drying out, so thermal performance remains stable across disassembly cycles. Breakdown voltage exceeds 9.8 kV at 1 mm thickness, confirming reliable insulation even under high electrical stress.

Najważniejsze cechy

  • High 12.8 W/mK conductivity moves heat fast from chips
  • Non-conductive silicone insulates safely at up to 200 °C
  • Soft 30–55 Shore hardness fills uneven gaps without pressure damage
  • Thin 0.5 mm profile fits tight laptop and GPU spaces
  • Stable from –40 °C to +400 °C for long-term reliability

Specyfikacja

SeriesThermal Pad
Model120x20x0.5mm
Volume / Net Weight15g
Thermal Conductivity12.8 W/mK,
Long Term Operating Temperature-40 C to +400C
SpecificationsColor:Gray Thermal Conductivity:12.8W/M-K Density:3.1±0.2g/cc Hardness:30-55(Sc) Breakdown Voltage:>9.8KV(1mm) Temperature Range:-40°C~200°C
FeaturesNon-Elecnical Conducive Non-Corrosive, Non-Curing & Non-Toxi One Pad , multi-purpose, durable,insulated, non-conductive lnsulation does not conduct electricity and is safe for use Natural viscosity, easy to assemble and reusable

Inne wersje tego modelu

Jeszcze 5 w tej samej serii

Ta sama rodzina, inna pamięć, inne chłodzenie lub taktowanie — proszę porównać przed decyzją.

Pytania dotyczące tego produktu

Does the 12.8 W/mK thermal pad maintain its conductivity after long periods at high temperature?

The pad is rated for continuous operation from -40 °C up to 200 °C, with a long-term limit of 400 °C, so sustained heat will not degrade its 12.8 W/mK performance.

Will the 0.5 mm silicone pad stay cool and quiet during all-day operation?

The pad itself generates no noise or heat; it simply transfers heat between components, and its non-curing, non-toxic silicone stays stable across the full -40 °C to 200 °C range.

What thickness of gap can the 120 x 20 mm pad fill without extra material?

The pad is 0.5 mm thick and compresses to bridge uneven surfaces, so it covers gaps up to its own thickness without needing additional shims or paste.

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