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Grey rectangular thermal pad 85 by 45 by 2.0 mm

Lirealar

Lirealar 85x45mm thermal paste 12.8 W/mK 15g

SKU CH-PFNK-Q7XYC MPN 85x45mm

A 15 g, 85×45 mm silicone pad rated at 12.8 W/mK fills gaps between CPUs, GPUs or LEDs and their heatsinks while remaining electrically non-conductive and stable from −40 °C to 200 °C

  • Volume / Net Weight15g
  • Thermal Conductivity12.8 W/mK,
  • Long Term Operating Temperature-40 C to +400C
  • SpecificationsColor:Gray Thermal Conductivity:12.8W/M-K Density:3.1±0.2g/c
  • FeaturesNon-Elecnical Conducive Non-Corrosive, Non-Curing & Non-Toxi

Type Thermal Pad

Model 85x45mm

Przekreślone wersje istnieją, ale nie są dostępne w tym miejscu.

Specification 2mm

Pokaż jeszcze 1 konfiguracji
  • High 12.8 W/mK conductivity moves heat fast from CPU or GPU
  • Non-conductive silicone insulates circuits and prevents short circuits
  • Soft 30–55 Shore C pad conforms to uneven surfaces without pressure damage
  • Operates reliably from –40 °C to +200 °C for long-term stability
  • 85 × 45 × 2.0 mm size fits laptop heatsinks, GPU blocks and LED coolers

Thermal pad for CPU GPU laptop heatsink

This 85x45mm silicone thermal pad targets builders who need a pre-cut interface between a heat-generating component and its cooler. It suits laptops, graphics cards, CPUs and LED modules where a uniform gap filler is preferred over paste. Buyers who want a liquid compound or a larger sheet for custom cuts should look elsewhere.

12.8 W/mK conductivity and 2.0mm thickness

The single specification that decides fit is the 12.8 W/mK thermal conductivity paired with a 2.0mm nominal thickness. This value determines whether the pad bridges the specific air gap in your assembly; a different gap height or required conductivity means this pad will not perform as intended.

Soft non-curing pad installs by hand

The material is non-curing, non-conductive and has natural viscosity, so you simply peel the liner and press it into place without tools. It compresses to fill uneven surfaces and can be repositioned during assembly. The only common issue is selecting the wrong thickness for the actual gap, which reduces contact pressure and thermal transfer.

Najważniejsze cechy

  • High 12.8 W/mK conductivity moves heat fast from CPU or GPU
  • Non-conductive silicone insulates circuits and prevents short circuits
  • Soft 30–55 Shore C pad conforms to uneven surfaces without pressure damage
  • Operates reliably from –40 °C to +200 °C for long-term stability
  • 85 × 45 × 2.0 mm size fits laptop heatsinks, GPU blocks and LED coolers

Specyfikacja

SeriesThermal Pad
Model85x45x2mm
Volume / Net Weight15g
Thermal Conductivity12.8 W/mK,
Long Term Operating Temperature-40 C to +400C
SpecificationsColor:Gray Thermal Conductivity:12.8W/M-K Density:3.1±0.2g/cc Hardness:30-55(Sc) Breakdown Voltage:>9.8KV(1mm) Temperature Range:-40°C~200°C
FeaturesNon-Elecnical Conducive Non-Corrosive, Non-Curing & Non-Toxi One Pad , multi-purpose, durable,insulated, non-conductive lnsulation does not conduct electricity and is safe for use Natural viscosity, easy to assemble and reusable

Inne wersje tego modelu

Jeszcze 5 w tej samej serii

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Pytania dotyczące tego produktu

How does 12.8 W/mK translate to real cooling performance?

The pad fills microscopic gaps between chip and heatsink, replacing trapped air with a 12.8 W/mK path so heat moves from the die to the cooler far more efficiently than with standard pads.

What does the >9.8 kV breakdown voltage limit in practice?

It confirms the pad stays electrically insulating up to 9.8 kV per millimetre, so it can safely bridge live components without shorting while still conducting heat.

Will the 85 x 45 x 2.0 mm pad fit my laptop GPU or CPU module?

The pad measures 85 mm by 45 mm and is 2.0 mm thick; it can be trimmed to match smaller die areas or irregular VRM layouts inside laptops and desktop cards.

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