Lirealar
Lirealar 85x45mm thermal pad 12.8 W/mK 1.0mm 15g
Silicone thermal pad measuring 85 by 45 by 1.0 mm with 12.8 W/mK conductivity, non-conductive insulation, and a -40 °C to 200 °C operating range
- Volume / Net Weight15g
- Thermal Conductivity12.8 W/mK,
- Long Term Operating Temperature-40 C to +400C
- SpecificationsColor:Gray Thermal Conductivity:12.8W/M-K Density:3.1±0.2g/c
- FeaturesNon-Elecnical Conducive Non-Corrosive, Non-Curing & Non-Toxi
Type Thermal Pad
- Thermal Pad
- Thermal Paste
Przekreślone wersje istnieją, ale nie są dostępne w tym miejscu.
- High thermal conductivity of 12.8 W/mK moves heat quickly
- Non-conductive insulation prevents electrical shorts
- Operates reliably from -40 °C to 200 °C
- Soft 30–55 Shore C hardness fills uneven gaps
- Reusable silicone pad resists curing and corrosion
Thermal pad 85 × 45 mm 1.0 mm thick
This silicone thermal pad measures 85 mm by 45 mm with a 1.0 mm thickness and weighs 15 g. It provides a thermal conductivity of 12.8 W/mK and operates from −40 °C to +200 °C. The material is non-conductive, non-corrosive, non-curing and non-toxic.
Suits single-component gap filling.
The pad fits one GPU, CPU, laptop heatsink or LED cooler where a single 85 × 45 mm piece covers the contact area. Builds that need to bridge several separate dies or larger surfaces will require additional pads or a different format. The one-piece design limits use to individual component interfaces.
12.8 W/mK conductivity decides fit
Thermal conductivity of 12.8 W/mK is the key figure that determines whether this pad meets the cooling demand of the target component. Lower-conductivity pads may not transfer heat quickly enough for high-power devices, while higher-conductivity options exist for more extreme loads. Match the 12.8 W/mK rating to the thermal design power of the part being cooled.
Najważniejsze cechy
- High thermal conductivity of 12.8 W/mK moves heat quickly
- Non-conductive insulation prevents electrical shorts
- Operates reliably from -40 °C to 200 °C
- Soft 30–55 Shore C hardness fills uneven gaps
- Reusable silicone pad resists curing and corrosion
Specyfikacja
| Series | Thermal Pad |
|---|---|
| Model | 85x45x1mm |
| Volume / Net Weight | 15g |
| Thermal Conductivity | 12.8 W/mK, |
| Long Term Operating Temperature | -40 C to +400C |
| Specifications | Color:Gray Thermal Conductivity:12.8W/M-K Density:3.1±0.2g/cc Hardness:30-55(Sc) Breakdown Voltage:>9.8KV(1mm) Temperature Range:-40°C~200°C |
| Features | Non-Elecnical Conducive Non-Corrosive, Non-Curing & Non-Toxi One Pad , multi-purpose, durable,insulated, non-conductive lnsulation does not conduct electricity and is safe for use Natural viscosity, easy to assemble and reusable |
Inne wersje tego modelu
Jeszcze 5 w tej samej serii
Ta sama rodzina, inna pamięć, inne chłodzenie lub taktowanie — proszę porównać przed decyzją.
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Pytania dotyczące tego produktu
How can I confirm the pad is working correctly after installing it on my GPU?
Monitor GPU temperatures under load; the 12.8 W/mK conductivity should lower junction temps compared to the previous interface material.
Does the 15 g package include only the single 85 x 45 x 1.0 mm pad or are extra shims supplied?
The box contains one gray silicone pad measuring 85 x 45 x 1.0 mm weighing 15 g; no additional shims or compound are included.
Should I choose the 1.0 mm thickness or a different height for a laptop heatsink gap?
Select 1.0 mm when the measured gap between die and heatsink is approximately 1 mm; the pad compresses within the 30-55 Shore C range to fill uneven surfaces.
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