Lirealar 120x20mm thermal pad 12.8 W/mK 3.0mm 15g
- 15g
- 12.8 W/mK,
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Lirealar
Silicone thermal pad measuring 120 x 120 x 0.5 mm with 12.8 W/mK conductivity for CPU, GPU and heatsink gap filling
Type Thermal Pad
This thermal pad sits between a heat-generating component and its heatsink to improve heat transfer. The silicone-based material fills microscopic gaps and uneven surfaces that would otherwise trap air. It is designed for use on desktop and laptop GPUs, CPUs, LED modules and other electronics requiring a compliant interface.
The pad suits repairs or upgrades where a 120mm square sheet of 0.5mm thickness matches the component stack height. It is not suitable for assemblies that require a thicker or thinner gap filler, nor for applications demanding a higher thermal conductivity rating than 12.8 W/mK.
This figure determines how effectively the pad moves heat across the interface. The material also withstands long-term operating temperatures from -40°C to 200°C and provides electrical insulation with a breakdown voltage above 9.8KV at 1mm thickness.
| Series | Thermal Pad |
|---|---|
| Model | 120x120x0.5mm |
| Volume / Net Weight | 15g |
| Thermal Conductivity | 12.8 W/mK, |
| Long Term Operating Temperature | -40 C to +400C |
| Specifications | Color:Gray Thermal Conductivity:12.8W/M-K Density:3.1±0.2g/cc Hardness:30-55(Sc) Breakdown Voltage:>9.8KV(1mm) Temperature Range:-40°C~200°C |
| Features | Non-Elecnical Conducive Non-Corrosive, Non-Curing & Non-Toxi One Pad , multi-purpose, durable,insulated, non-conductive lnsulation does not conduct electricity and is safe for use Natural viscosity, easy to assemble and reusable |
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The pad is 0.5 mm thick and compresses to bridge uneven surfaces and air gaps between the heat source and heatsink.
Cut the 120x120 mm sheet to size, peel the protective film, place it on the clean component, then press the heatsink down evenly so the natural viscosity spreads the pad.
The non-curing silicone stays pliable from -40 °C to 200 °C; replace it only if the pad dries out, tears, or thermal performance drops after repeated disassembly.
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