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Lirealar

Lirealar 120x120mm thermal pad 12.8 W/mK 0.5mm 15g

SKU CH-TRTV-VNJQ4 MPN 120x120mm

Silicone thermal pad measuring 120 x 120 x 0.5 mm with 12.8 W/mK conductivity for CPU, GPU and heatsink gap filling

  • Volume / Net Weight15g
  • Thermal Conductivity12.8 W/mK,
  • Long Term Operating Temperature-40 C to +400C
  • SpecificationsColor:Gray Thermal Conductivity:12.8W/M-K Density:3.1±0.2g/c
  • FeaturesNon-Elecnical Conducive Non-Corrosive, Non-Curing & Non-Toxi

Type Thermal Pad

Model 120x120mm

Specification 0.5mm

顯示另外 1 款選項
  • High 12.8 W/mK conductivity moves heat efficiently
  • Non-conductive insulation prevents electrical shorts on components
  • Operates from -40 °C to 200 °C for wide temperature stability
  • Compressible 0.5 mm pad fills uneven gaps between surfaces
  • Reusable non-curing material allows easy re-assembly

Thermal pad for component cooling

This thermal pad sits between a heat-generating component and its heatsink to improve heat transfer. The silicone-based material fills microscopic gaps and uneven surfaces that would otherwise trap air. It is designed for use on desktop and laptop GPUs, CPUs, LED modules and other electronics requiring a compliant interface.

Builders needing a 12.8 W/mK 0.5mm pad

The pad suits repairs or upgrades where a 120mm square sheet of 0.5mm thickness matches the component stack height. It is not suitable for assemblies that require a thicker or thinner gap filler, nor for applications demanding a higher thermal conductivity rating than 12.8 W/mK.

12.8 W/mK thermal conductivity rating

This figure determines how effectively the pad moves heat across the interface. The material also withstands long-term operating temperatures from -40°C to 200°C and provides electrical insulation with a breakdown voltage above 9.8KV at 1mm thickness.

商品特色

  • High 12.8 W/mK conductivity moves heat efficiently
  • Non-conductive insulation prevents electrical shorts on components
  • Operates from -40 °C to 200 °C for wide temperature stability
  • Compressible 0.5 mm pad fills uneven gaps between surfaces
  • Reusable non-curing material allows easy re-assembly

商品規格

SeriesThermal Pad
Model120x120x0.5mm
Volume / Net Weight15g
Thermal Conductivity12.8 W/mK,
Long Term Operating Temperature-40 C to +400C
SpecificationsColor:Gray Thermal Conductivity:12.8W/M-K Density:3.1±0.2g/cc Hardness:30-55(Sc) Breakdown Voltage:>9.8KV(1mm) Temperature Range:-40°C~200°C
FeaturesNon-Elecnical Conducive Non-Corrosive, Non-Curing & Non-Toxi One Pad , multi-purpose, durable,insulated, non-conductive lnsulation does not conduct electricity and is safe for use Natural viscosity, easy to assemble and reusable

其他版本

同系列還有 5 款

同系列產品,記憶體、散熱器或時脈不同 — 下單前請先比較。

商品問答

What gap thickness does the 0.5 mm pad fill between a heatsink and component?

The pad is 0.5 mm thick and compresses to bridge uneven surfaces and air gaps between the heat source and heatsink.

How do I install the 120x120 mm pad without tearing the silicone sheet?

Cut the 120x120 mm sheet to size, peel the protective film, place it on the clean component, then press the heatsink down evenly so the natural viscosity spreads the pad.

When should I replace the 15 g thermal pad after long-term use?

The non-curing silicone stays pliable from -40 °C to 200 °C; replace it only if the pad dries out, tears, or thermal performance drops after repeated disassembly.

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