Lirealar
Lirealar 120x120mm thermal pad 12.8 W/mK 0.5mm 15g
Silicone thermal pad measuring 120 x 120 x 0.5 mm with 12.8 W/mK conductivity for CPU, GPU and heatsink gap filling
- Volume / Net Weight15g
- Thermal Conductivity12.8 W/mK,
- Long Term Operating Temperature-40 C to +400C
- SpecificationsColor:Gray Thermal Conductivity:12.8W/M-K Density:3.1±0.2g/c
- FeaturesNon-Elecnical Conducive Non-Corrosive, Non-Curing & Non-Toxi
Type Thermal Pad
- Thermal Pad
- Thermal Paste
Struck-through versions exist but are not stocked here.
- High 12.8 W/mK conductivity moves heat efficiently
- Non-conductive insulation prevents electrical shorts on components
- Operates from -40 °C to 200 °C for wide temperature stability
- Compressible 0.5 mm pad fills uneven gaps between surfaces
- Reusable non-curing material allows easy re-assembly
Thermal pad for component cooling
This thermal pad sits between a heat-generating component and its heatsink to improve heat transfer. The silicone-based material fills microscopic gaps and uneven surfaces that would otherwise trap air. It is designed for use on desktop and laptop GPUs, CPUs, LED modules and other electronics requiring a compliant interface.
Builders needing a 12.8 W/mK 0.5mm pad
The pad suits repairs or upgrades where a 120mm square sheet of 0.5mm thickness matches the component stack height. It is not suitable for assemblies that require a thicker or thinner gap filler, nor for applications demanding a higher thermal conductivity rating than 12.8 W/mK.
12.8 W/mK thermal conductivity rating
This figure determines how effectively the pad moves heat across the interface. The material also withstands long-term operating temperatures from -40°C to 200°C and provides electrical insulation with a breakdown voltage above 9.8KV at 1mm thickness.
Highlights
- High 12.8 W/mK conductivity moves heat efficiently
- Non-conductive insulation prevents electrical shorts on components
- Operates from -40 °C to 200 °C for wide temperature stability
- Compressible 0.5 mm pad fills uneven gaps between surfaces
- Reusable non-curing material allows easy re-assembly
Specifications
| Series | Thermal Pad |
|---|---|
| Model | 120x120x0.5mm |
| Volume / Net Weight | 15g |
| Thermal Conductivity | 12.8 W/mK, |
| Long Term Operating Temperature | -40 C to +400C |
| Specifications | Color:Gray Thermal Conductivity:12.8W/M-K Density:3.1±0.2g/cc Hardness:30-55(Sc) Breakdown Voltage:>9.8KV(1mm) Temperature Range:-40°C~200°C |
| Features | Non-Elecnical Conducive Non-Corrosive, Non-Curing & Non-Toxi One Pad , multi-purpose, durable,insulated, non-conductive lnsulation does not conduct electricity and is safe for use Natural viscosity, easy to assemble and reusable |
Other versions of this model
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Questions about this item
What gap thickness does the 0.5 mm pad fill between a heatsink and component?
The pad is 0.5 mm thick and compresses to bridge uneven surfaces and air gaps between the heat source and heatsink.
How do I install the 120x120 mm pad without tearing the silicone sheet?
Cut the 120x120 mm sheet to size, peel the protective film, place it on the clean component, then press the heatsink down evenly so the natural viscosity spreads the pad.
When should I replace the 15 g thermal pad after long-term use?
The non-curing silicone stays pliable from -40 °C to 200 °C; replace it only if the pad dries out, tears, or thermal performance drops after repeated disassembly.
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