Lirealar
Lirealar 120x120mm 1.0mm thermal pad 12.8 W/mK 15g
A 120 x 120 x 1.0 mm silicone thermal pad rated at 12.8 W/mK for CPU, GPU and heatsink gap filling
- Volume / Net Weight15g
- Thermal Conductivity12.8 W/mK,
- Long Term Operating Temperature-40 C to +400C
- SpecificationsColor:Gray Thermal Conductivity:12.8W/M-K Density:3.1±0.2g/c
- FeaturesNon-Elecnical Conducive Non-Corrosive, Non-Curing & Non-Toxi
Type Thermal Pad
- Thermal Pad
- Thermal Paste
Struck-through versions exist but are not stocked here.
- High 12.8 W/mK conductivity moves heat fast from GPU or CPU
- 120 × 120 × 1.0 mm sheet covers large heatsink areas in one piece
- Non-conductive and non-corrosive material protects sensitive electronics
- Soft 30–55 Shore C pad compresses to fill uneven gaps without pressure damage
- Operates reliably from –40 °C to 200 °C for long-term stability
Product Identity
This is a 120mm by 120mm thermal pad with a 1.0mm thickness and 12.8 W/mK conductivity. It suits anyone fitting a fresh interface between a heatsink and a GPU, CPU, or LED module in a desktop or laptop. Buyers who need a thinner or thicker gap filler cannot use this single pad.
Build & Handling
The grey silicone sheet weighs 15g and has a density of 3.1±0.2g/cc with 30-55 Shore C hardness. It is non-conductive, non-corrosive, non-curing and non-toxic, so it will not short components or degrade over time. Natural viscosity lets it stay in place during assembly and allows removal for rework without leaving residue.
In-Use Benefits
One pad covers the full 120x120mm area, eliminating the need to cut smaller pieces for large contact surfaces. The material compresses to fill uneven topography and air gaps, lowering contact resistance across the whole interface. Rated from -40°C to 200°C continuous with a breakdown voltage above 9.8kV, it remains stable in sustained high-temperature operation.
Highlights
- High 12.8 W/mK conductivity moves heat fast from GPU or CPU
- 120 × 120 × 1.0 mm sheet covers large heatsink areas in one piece
- Non-conductive and non-corrosive material protects sensitive electronics
- Soft 30–55 Shore C pad compresses to fill uneven gaps without pressure damage
- Operates reliably from –40 °C to 200 °C for long-term stability
Specifications
| Series | Thermal Pad |
|---|---|
| Model | 120x120x1.0mm |
| Volume / Net Weight | 15g |
| Thermal Conductivity | 12.8 W/mK, |
| Long Term Operating Temperature | -40 C to +400C |
| Specifications | Color:Gray Thermal Conductivity:12.8W/M-K Density:3.1±0.2g/cc Hardness:30-55(Sc) Breakdown Voltage:>9.8KV(1mm) Temperature Range:-40°C~200°C |
| Features | Non-Elecnical Conducive Non-Corrosive, Non-Curing & Non-Toxi One Pad , multi-purpose, durable,insulated, non-conductive lnsulation does not conduct electricity and is safe for use Natural viscosity, easy to assemble and reusable |
Other versions of this model
5 more in the same range
Same family, different memory, cooler or clock — compare before you commit.
Questions about this item
What thermal conductivity does the 120x120mm pad provide?
The pad delivers 12.8 W/mK thermal conductivity, moving heat efficiently between the component and heatsink.
What thickness and size must the mounting surface accommodate?
The pad measures 120x120mm with a 1.0mm thickness, so the contact area and gap must match those dimensions.
How do I install the pad without tearing it?
Peel the protective film, align the grey 15g sheet on the chip, then press the heatsink down evenly; the natural viscosity holds it without adhesive.
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