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Square grey thermal pad 120 by 120 by 1.0 mm 15 g

Lirealar

Lirealar 120x120mm 1.0mm thermal pad 12.8 W/mK 15g

SKU CH-51V0-CX4T2 MPN 120x120mm

A 120 x 120 x 1.0 mm silicone thermal pad rated at 12.8 W/mK for CPU, GPU and heatsink gap filling

  • Volume / Net Weight15g
  • Thermal Conductivity12.8 W/mK,
  • Long Term Operating Temperature-40 C to +400C
  • SpecificationsColor:Gray Thermal Conductivity:12.8W/M-K Density:3.1±0.2g/c
  • FeaturesNon-Elecnical Conducive Non-Corrosive, Non-Curing & Non-Toxi

Type Thermal Pad

Model 120x120mm

Le versioni barrate esistono, ma non sono disponibili qui.

Specification 1.0mm

Mostra altre 1 configurazioni
  • High 12.8 W/mK conductivity moves heat fast from GPU or CPU
  • 120 × 120 × 1.0 mm sheet covers large heatsink areas in one piece
  • Non-conductive and non-corrosive material protects sensitive electronics
  • Soft 30–55 Shore C pad compresses to fill uneven gaps without pressure damage
  • Operates reliably from –40 °C to 200 °C for long-term stability

Product Identity

This is a 120mm by 120mm thermal pad with a 1.0mm thickness and 12.8 W/mK conductivity. It suits anyone fitting a fresh interface between a heatsink and a GPU, CPU, or LED module in a desktop or laptop. Buyers who need a thinner or thicker gap filler cannot use this single pad.

Build & Handling

The grey silicone sheet weighs 15g and has a density of 3.1±0.2g/cc with 30-55 Shore C hardness. It is non-conductive, non-corrosive, non-curing and non-toxic, so it will not short components or degrade over time. Natural viscosity lets it stay in place during assembly and allows removal for rework without leaving residue.

In-Use Benefits

One pad covers the full 120x120mm area, eliminating the need to cut smaller pieces for large contact surfaces. The material compresses to fill uneven topography and air gaps, lowering contact resistance across the whole interface. Rated from -40°C to 200°C continuous with a breakdown voltage above 9.8kV, it remains stable in sustained high-temperature operation.

Punti di forza

  • High 12.8 W/mK conductivity moves heat fast from GPU or CPU
  • 120 × 120 × 1.0 mm sheet covers large heatsink areas in one piece
  • Non-conductive and non-corrosive material protects sensitive electronics
  • Soft 30–55 Shore C pad compresses to fill uneven gaps without pressure damage
  • Operates reliably from –40 °C to 200 °C for long-term stability

Caratteristiche tecniche

SeriesThermal Pad
Model120x120x1.0mm
Volume / Net Weight15g
Thermal Conductivity12.8 W/mK,
Long Term Operating Temperature-40 C to +400C
SpecificationsColor:Gray Thermal Conductivity:12.8W/M-K Density:3.1±0.2g/cc Hardness:30-55(Sc) Breakdown Voltage:>9.8KV(1mm) Temperature Range:-40°C~200°C
FeaturesNon-Elecnical Conducive Non-Corrosive, Non-Curing & Non-Toxi One Pad , multi-purpose, durable,insulated, non-conductive lnsulation does not conduct electricity and is safe for use Natural viscosity, easy to assemble and reusable

Altre versioni di questo modello

altri 5 nella stessa gamma

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Domande su questo articolo

What thermal conductivity does the 120x120mm pad provide?

The pad delivers 12.8 W/mK thermal conductivity, moving heat efficiently between the component and heatsink.

What thickness and size must the mounting surface accommodate?

The pad measures 120x120mm with a 1.0mm thickness, so the contact area and gap must match those dimensions.

How do I install the pad without tearing it?

Peel the protective film, align the grey 15g sheet on the chip, then press the heatsink down evenly; the natural viscosity holds it without adhesive.

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