Lirealar
Lirealar TF8 Thermal Paste 13.8 W/mK 12.8g
High-conductivity carbon paste rated at 13.8 W/mK for CPU and GPU cooling, non-conductive and non-corrosive, supplied in a 12.8 g syringe with applicator
- Volume / Net Weight12.8g
- Thermal Conductivity13.8 W/mK,
- Long Term Operating Temperature-220~380°C
- SpecificationsColor:Gray Thermal resistance:<0.01(°C-CM²/W) Density:2.9(25
- FeaturesHigh Thermal Conductivity 13.8 W/mK Non-Elecnical Conducive
Type Thermal Paste
- Thermal Pad
- Thermal Paste
Struck-through versions exist but are not stocked here.
- High thermal conductivity 13.8 W/mK moves heat fast
- Non-electrically conductive paste prevents short circuits
- Carbon-based formula stays effective for at least six years
- Wide operating range from -220 °C to 380 °C
- 8 g syringe with tool covers multiple applications
Carbon-based thermal compound
Lirealar TF8 is a carbon-based thermal paste designed for CPU and GPU heat transfer in desktop and laptop systems. The 12.8g syringe provides enough material for multiple applications. It is intended for builders and technicians who need a non-electrically-conductive interface material.
13.8 W/mK thermal conductivity
The paste delivers a thermal conductivity of 13.8 W/mK, which is the primary figure that determines its suitability for a given cooling requirement. Thermal resistance is rated below 0.01 °C·cm²/W at a density of 2.9 g/cm³ measured at 25 °C. The compound remains stable across an operating range of -220 °C to 380 °C.
Included spreader tool and six-year durability
A spreader tool is bundled to help achieve an even layer and avoid voids between the die and cooler base. The formula is non-corrosive, non-curing and non-toxic, and the manufacturer states it retains performance for at least six years without re-application.
Highlights
- High thermal conductivity 13.8 W/mK moves heat fast
- Non-electrically conductive paste prevents short circuits
- Carbon-based formula stays effective for at least six years
- Wide operating range from -220 °C to 380 °C
- 8 g syringe with tool covers multiple applications
Specifications
| Series | Thermal Paste |
|---|---|
| Model | TF8 Thermal Compound Paste |
| Volume / Net Weight | 12.8g |
| Thermal Conductivity | 13.8 W/mK, |
| Long Term Operating Temperature | -220~380°C |
| Specifications | Color:Gray Thermal resistance:<0.01(°C-CM²/W) Density:2.9(25°C) Operating temperature:-220~380°C Electrical conductivity:NO Harmless:YES Content: 12.8g |
| Features | High Thermal Conductivity 13.8 W/mK Non-Elecnical Conducive Non-Corrosive, Non-Curing & Non-Toxi lnsulation does not conduct electricity and is safe for use It will last At least for 6 years |
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Questions about this item
How much difference will the 13.8 W/mK conductivity make once the paste is between my CPU and cooler?
The high conductivity rating means heat moves from the processor into the heatsink more efficiently, helping keep temperatures lower under load.
The spec lists thermal resistance below 0.01 °C-cm²/W — what does that limit in practice?
That low resistance figure shows the paste itself adds almost no barrier to heat flow, so the cooler can work at its full potential.
What do I need to spread the 12.8 g syringe and will it fit standard CPU sockets?
The package includes an applicator tool, and the non-curing gray compound spreads easily over any desktop or laptop CPU heatspreader.
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