Lirealar 120x20mm 12.8 W/mK thermal pad 0.5mm 15g
- 15g
- 12.8 W/mK,
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Lirealar
A 120×20 mm, 3.0 mm thick silicone thermal pad rated at 12.8 W/mK that fills gaps between CPUs, GPUs or LED modules and their heatsinks while remaining electrically non-conductive and reusable
Type Thermal Pad
This Lirealar thermal pad measures 120x20mm with a 3.0mm thickness and weighs 15g. It delivers 12.8 W/mK thermal conductivity to transfer heat between components and heatsinks. The silicone material is non-conductive, non-corrosive and non-curing for safe, long-term use.
Ensure the 3.0mm thickness matches the exact gap between your heat source and cooler. Verify the 120x20mm dimensions cover the entire contact surface on your laptop heatsink, GPU or CPU. The pad operates from -40°C to 200°C continuously, with a wider survival range to 400°C.
Upgrade from standard pads below 12.8 W/mK when thermal resistance limits cooling performance. The reusable, non-curing pad avoids the pump-out and drying issues of thermal grease. Not suited for builds needing electrically conductive interfaces or thicknesses other than 3.0mm.
| Series | Thermal Pad |
|---|---|
| Model | 120x20x3.0mm |
| Volume / Net Weight | 15g |
| Thermal Conductivity | 12.8 W/mK, |
| Long Term Operating Temperature | -40 C to +400C |
| Specifications | Color:Gray Thermal Conductivity:12.8W/M-K Density:3.1±0.2g/cc Hardness:30-55(Sc) Breakdown Voltage:>9.8KV(1mm) Temperature Range:-40°C~200°C |
| Features | Non-Elecnical Conducive Non-Corrosive, Non-Curing & Non-Toxi One Pad , multi-purpose, durable,insulated, non-conductive lnsulation does not conduct electricity and is safe for use Natural viscosity, easy to assemble and reusable |
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The package contains one 15 g thermal pad measuring 120 x 20 x 3.0 mm. It has natural viscosity so no separate adhesive or paste is required.
This model is a single 3.0 mm thick pad rated at 12.8 W/mK. Measure the gap between your component and heatsink; if it matches 3.0 mm this pad will fill it.
The 12.8 W/mK conductivity fills microscopic air gaps up to 3.0 mm thick, lowering contact resistance so heat moves from the GPU die to the heatsink more efficiently.
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