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Grey rectangular silicone thermal pad 120 by 20 by 3.0 mm 15 g

Lirealar

Lirealar 120x20mm thermal pad 12.8 W/mK 3.0mm 15g

SKU CH-C72T-HGWED MPN 120x20mm

A 120×20 mm, 3.0 mm thick silicone thermal pad rated at 12.8 W/mK that fills gaps between CPUs, GPUs or LED modules and their heatsinks while remaining electrically non-conductive and reusable

  • Volume / Net Weight15g
  • Thermal Conductivity12.8 W/mK,
  • Long Term Operating Temperature-40 C to +400C
  • SpecificationsColor:Gray Thermal Conductivity:12.8W/M-K Density:3.1±0.2g/c
  • FeaturesNon-Elecnical Conducive Non-Corrosive, Non-Curing & Non-Toxi

Type Thermal Pad

Model 120x20mm

De overstregede versioner findes, men er ikke på lager her.

Specification 3.0mm

Vis 1 flere konfigurationer
  • High 12.8 W/mK conductivity moves heat fast from GPU or CPU
  • 0 mm thickness fills uneven gaps between chip and heatsink reliably
  • Non-conductive silicone insulates electrically while transferring heat safely
  • Operates from -40 °C to 200 °C for stable long-term use
  • Natural tack lets you position and reuse the pad without mess

High-conductivity thermal pad for laptops and GPUs

This Lirealar thermal pad measures 120x20mm with a 3.0mm thickness and weighs 15g. It delivers 12.8 W/mK thermal conductivity to transfer heat between components and heatsinks. The silicone material is non-conductive, non-corrosive and non-curing for safe, long-term use.

Check component gap and surface area before ordering

Ensure the 3.0mm thickness matches the exact gap between your heat source and cooler. Verify the 120x20mm dimensions cover the entire contact surface on your laptop heatsink, GPU or CPU. The pad operates from -40°C to 200°C continuously, with a wider survival range to 400°C.

Replaces lower-conductivity pads and messy pastes

Upgrade from standard pads below 12.8 W/mK when thermal resistance limits cooling performance. The reusable, non-curing pad avoids the pump-out and drying issues of thermal grease. Not suited for builds needing electrically conductive interfaces or thicknesses other than 3.0mm.

Fordele

  • High 12.8 W/mK conductivity moves heat fast from GPU or CPU
  • 0 mm thickness fills uneven gaps between chip and heatsink reliably
  • Non-conductive silicone insulates electrically while transferring heat safely
  • Operates from -40 °C to 200 °C for stable long-term use
  • Natural tack lets you position and reuse the pad without mess

Specifikationer

SeriesThermal Pad
Model120x20x3.0mm
Volume / Net Weight15g
Thermal Conductivity12.8 W/mK,
Long Term Operating Temperature-40 C to +400C
SpecificationsColor:Gray Thermal Conductivity:12.8W/M-K Density:3.1±0.2g/cc Hardness:30-55(Sc) Breakdown Voltage:>9.8KV(1mm) Temperature Range:-40°C~200°C
FeaturesNon-Elecnical Conducive Non-Corrosive, Non-Curing & Non-Toxi One Pad , multi-purpose, durable,insulated, non-conductive lnsulation does not conduct electricity and is safe for use Natural viscosity, easy to assemble and reusable

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Spørgsmål om denne vare

Is the 120 x 20 x 3.0 mm pad the only item included, or do I need extra adhesive or paste?

The package contains one 15 g thermal pad measuring 120 x 20 x 3.0 mm. It has natural viscosity so no separate adhesive or paste is required.

I see only the 12.8 W/mK 3.0 mm version listed — how do I know this is the right thickness for my laptop heatsink?

This model is a single 3.0 mm thick pad rated at 12.8 W/mK. Measure the gap between your component and heatsink; if it matches 3.0 mm this pad will fill it.

What does the 12.8 W/mK rating actually deliver once the pad is installed between a GPU and its cooler?

The 12.8 W/mK conductivity fills microscopic air gaps up to 3.0 mm thick, lowering contact resistance so heat moves from the GPU die to the heatsink more efficiently.

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