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Grey square thermal pad 120 by 120 by 3.0 mm 15 g

Lirealar

Lirealar 120x120mm 12.8 W/mK thermal pad 3.0mm 15g

SKU CH-88MK-FTT3T MPN 120x120mm

A 12.8 W/mK silicone pad fills gaps between CPUs, GPUs or LED coolers and heatsinks, insulating electrically while transferring heat from -40 °C to 200 °C

  • Volume / Net Weight15g
  • Thermal Conductivity12.8 W/mK,
  • Long Term Operating Temperature-40 C to +400C
  • SpecificationsColor:Gray Thermal Conductivity:12.8W/M-K Density:3.1±0.2g/c
  • FeaturesNon-Elecnical Conducive Non-Corrosive, Non-Curing & Non-Toxi

Type Thermal Pad

Model 120x120mm

De overstregede versioner findes, men er ikke på lager her.

Specification 3.0mm

Vis 1 flere konfigurationer
  • High thermal conductivity of 12.8 W/mK moves heat efficiently from CPU or GPU to heatsink
  • Non-conductive insulation with >9.8 kV breakdown voltage protects components from electrical shorts
  • Compressible 3.0 mm thickness fills uneven gaps between surfaces for reliable contact
  • Operates continuously from -40 °C to 200 °C and withstands peaks up to 400 °C
  • Reusable 15 g pad with natural viscosity installs easily and requires no curing time

Ready-cut thermal pad 120 × 120 mm

This 120 × 120 mm silicone pad is 3.0 mm thick and rated at 12.8 W/mK thermal conductivity. It targets builders who need a single-piece interface for GPU memory modules, VRM heatsinks or laptop heatspreaders where a pre-cut sheet saves trimming time. The grey material weighs 15 g and remains non-conductive, non-corrosive and non-curing across a long-term range of −40 °C to +400 °C. It suits DIY upgrades where electrical insulation between the die and cooler is mandatory.

Pre-cut sheet replaces paste and trimming

Supplied as one 15 g pad, it eliminates the syringe, spreader and cleanup associated with thermal grease. The natural tack holds the pad in place during assembly without adhesive residue, and the sheet can be lifted and repositioned if alignment shifts. Because the compound does not cure, the interface stays compliant through repeated thermal cycles, so the same pad can be reused when swapping coolers or repasting a laptop. No separate insulator or shim is required.

Simple press-fit install; avoid over-compression

Peel the protective film, lay the pad on the component and mount the heatsink — the 30–55 Shore C hardness compresses to fill microscopic gaps without flowing off the die. The main risk is stacking multiple pads or torquing the mount beyond the pad’s 3.1 g/cc density limit, which can reduce contact area and raise temperatures. Breakdown voltage exceeds 9.8 kV at 1 mm thickness, so electrical shorts are unlikely if the pad covers the entire contact zone. Trim only if the target surface is smaller than 120 mm.

Fordele

  • High thermal conductivity of 12.8 W/mK moves heat efficiently from CPU or GPU to heatsink
  • Non-conductive insulation with >9.8 kV breakdown voltage protects components from electrical shorts
  • Compressible 3.0 mm thickness fills uneven gaps between surfaces for reliable contact
  • Operates continuously from -40 °C to 200 °C and withstands peaks up to 400 °C
  • Reusable 15 g pad with natural viscosity installs easily and requires no curing time

Specifikationer

SeriesThermal Pad
Model120x120x3.0mm
Volume / Net Weight15g
Thermal Conductivity12.8 W/mK,
Long Term Operating Temperature-40 C to +400C
SpecificationsColor:Gray Thermal Conductivity:12.8W/M-K Density:3.1±0.2g/cc Hardness:30-55(Sc) Breakdown Voltage:>9.8KV(1mm) Temperature Range:-40°C~200°C
FeaturesNon-Elecnical Conducive Non-Corrosive, Non-Curing & Non-Toxi One Pad , multi-purpose, durable,insulated, non-conductive lnsulation does not conduct electricity and is safe for use Natural viscosity, easy to assemble and reusable

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Spørgsmål om denne vare

When will the 3.0 mm pad need replacement?

The silicone pad is non-curing and reusable, so it does not dry out or degrade; replace only if physically damaged or when re-assembling the heatsink.

What thermal limit appears first during continuous load?

The pad is rated for long-term operation up to 200 °C, so the component junction temperature will reach its limit before the pad material does.

How much power does the pad draw or heat does it add when running all day?

The pad consumes no power and adds no heat; its 12.8 W/mK conductivity simply transfers existing heat from the component to the heatsink.

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