BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
- Rackmount
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Corsair
A 64GB kit of four 16GB DDR4 3600 CL18 modules with a low 34mm profile, aluminum heatspreaders and Intel XMP 2.0 support
This kit delivers 64GB of DDR4 memory across four 16GB modules, giving a full four-channel population for desktop platforms that support it. The 288-pin form factor fits standard consumer motherboards and the black anodized aluminum heatspreader keeps the modules low enough for most small-form-factor builds at 34mm tall.
The memory runs at DDR4 3600 (PC4 28800) with a rated voltage of 1.35V and timings of 18-22-22-42, which is the highest JEDEC-defined speed tier for DDR4 before overclocking headroom begins. Intel XMP 2.0 support allows the rated profile to be applied with a single BIOS setting, but stability at this frequency still depends on the memory controller quality of the specific CPU and the motherboard topology.
The CL18 CAS latency is the single figure that determines whether this kit matches the latency budget of a given workload; lower latency at the same frequency yields snappier response in latency-sensitive tasks, while higher latency may be acceptable for throughput-oriented applications. Hand-sorted chips and a high-performance PCB provide overclocking headroom, but the rated CL18 at 3600MT/s remains the baseline specification to evaluate against system requirements.
| Brand | CORSAIR |
|---|---|
| Series | Vengeance LPX |
| Model | CMK64GX4M4D3600C18 |
| Capacity | 64GB (4 x 16GB) |
| Type | 288-Pin PC RAM |
| Speed | DDR4 3600 (PC4 28800) |
| CAS Latency | CL18 |
| Timing | 18-22-22-42 |
| Voltage | 1.35V |
| BIOS/Performance Profile | Intel XMP 2.0 |
| Color | Black |
| Heat Spreader | Anodized Aluminum |
| Features | Hand-sorted memory chips ensure high performance with generous overclocking headroom. VENGEANCE LPX is optimized for wide compatibility with the latest Intel and AMD DDR4 motherboards. A low-profile height of just 34mm ensures that VENGEANCE LPX even fits in most small-form-factor builds. A high-performance PCB guarantees strong signal quality and stability for superior overclocking ability. A solid aluminum heatspreader efficiently dissipates heat from each module so that they consistently run at high clock speeds. Supports Intel XMP 2.0 for simple one-setting installation and setup |
| Recommend Use | AMD 400 Series / AMD 500 Series / Intel 300 Series / Intel 400 Series |
| Berat penghantaran | 0.20 kg |
| Dimensi bungkusan | 154 × 90 × 20 mm |
The low-profile 34mm height is designed to fit under most large air coolers and in small-form-factor cases, leaving ample clearance for typical heatsink overhang.
The modules default to standard JEDEC speeds; enabling the Intel XMP 2.0 profile in the BIOS sets the rated 3600 MT/s, CL18-22-22-42 timings and 1.35 V with a single selection.
This is a matched 4×16 GB kit tested to run together at the rated speed; installing all four modules fills two slots per channel on mainstream dual-channel platforms.
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