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Green rectangular DDR3 UDIMM module with gold contacts and black chips on both sides

OWC

OWC 4GB DDR3 1333 PC3-10600 CL9 2Rx8 240-pin 1.5V UDIMM for HP Pro 3330 3400 3405

SKU CH-459F-PKXM9

4GB DDR3 1333MHz CL9 UDIMM upgrades HP Pro 3330, 3400 and 3405 desktops

  • Capacity4GB
  • Type240-Pin DDR3 Non-ECC UDIMM
  • SpeedDDR3 1333 (PC3 10600)
  • CAS LatencyCL9
  • Voltage1.5V
  • ECCNo
  • 4GB capacity expands multitasking headroom for everyday workloads
  • DDR3 1333 speed matches HP Pro 3330, 3400 and 3405 specifications
  • CL9 latency and 1.5V operation meet JEDEC standard timings
  • 240-pin UDIMM form factor fits desktop memory slots directly
  • 2Rx8 unbuffered non-ECC design ensures broad desktop compatibility

HP Pro 3330, 3400, 3405 memory upgrade

This 4GB DDR3 1333 module is built for HP Pro 3330, 3400 and 3405 desktops and workstations. It delivers a single 4GB DIMM running at PC3-10600 speed with CL9 latency and 1.5V operation. The unbuffered, non-ECC design matches the original system requirements. It suits owners of those specific HP models who need a straightforward capacity increase.

JEDEC and RoHS compliance changes the risk profile

The module meets JEDEC standards and is RoHS compliant, so it qualifies as a warranty-safe upgrade for the supported HP systems. OWC tests every unit in-house before shipment, reducing the chance of a defective stick. The advanced replacement programme and lifetime warranty with free tech support add a safety net that pure commodity memory often lacks.

Green PCB, no heat spreader, standard 240-pin layout

The stick uses a plain green circuit board without a heat spreader, keeping the profile low for tight chassis clearance. Gold-edge contacts on the 240-pin DDR3 interface ensure reliable seating in the motherboard slots. Builders who need ECC, registered signalling, or higher voltages cannot use this module; it is strictly non-ECC unbuffered at 1.5V.

Ciri-ciri utama

  • 4GB capacity expands multitasking headroom for everyday workloads
  • DDR3 1333 speed matches HP Pro 3330, 3400 and 3405 specifications
  • CL9 latency and 1.5V operation meet JEDEC standard timings
  • 240-pin UDIMM form factor fits desktop memory slots directly
  • 2Rx8 unbuffered non-ECC design ensures broad desktop compatibility

Spesifikasi

BrandOWC
Part Number1U3D32R804GB
Capacity4GB
Type240-Pin DDR3 Non-ECC UDIMM
SpeedDDR3 1333 (PC3 10600)
CAS LatencyCL9
Voltage1.5V
ECCNo
Buffered/RegisteredUnbuffered
Rank2Rx8
Heat SpreaderNo
Compatible SystemHP Pro 3330
HP Pro 3400
HP Pro 3405

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Will the 240-pin DDR3 module need any periodic cleaning or component replacement after installation?

No, the 4GB DDR3 1333 UDIMM has no moving parts or heat spreader and requires no scheduled maintenance once seated in the HP Pro 3330 3400 or 3405.

What limit appears first when the 4GB DDR3 1333 CL9 stick runs at full load for hours?

The single 4GB capacity is the first constraint; sustained workloads will exhaust the addressable memory space before the 1.5V DDR3 1333 interface saturates.

How much heat or fan noise does the unbuffered 2Rx8 DDR3 module add during all-day operation?

The 1.5V non-ECC DDR3 1333 UDIMM runs without a heat spreader and draws minimal power, so it adds negligible heat or acoustic load to the HP Pro chassis.

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