Kami menerima kripto — jadi koin yang anda simpan boleh membeli perkakasan sebenar.Bayar dengan kripto, belanjakannya untuk perkakasan sebenar. Penghantaran berinsurans percuma ke seluruh dunia untuk belian melebihi USD 399. Kotak biasa tanpa jenama, dihantar dari Jerman.Penghantaran berinsurans percuma untuk belian melebihi USD 399. Kadar anda dikunci selama 30 minit sebaik sahaja proses pesanan bermula.Kadar dikunci selama 30 minit. Setiap item disegel, nombor sirinya disemak, dan dilindungi waranti 24 bulan.Disegel, waranti 24 bulan.

Barang disimpan Log masuk
Small syringe of silver liquid-metal thermal paste, 1.0g

UPSIREN

UPSIREN Conductonaut LMTG-100 liquid metal thermal paste 1.0g 100W/Mk

SKU CH-6E34-69TFW

Non-conductive liquid-metal microcapsule paste with 100 W/mK conductivity for CPU and GPU cooling from 10 °C to 140 °C

  • Volume / Net Weight1.0g
  • Thermal Conductivity100W/Mk
  • Long Term Operating Temperature10 °C -140°C
  • Non-conductive formula prevents motherboard short circuits
  • Polymer microcapsules block oxidation for lasting performance
  • Applies like standard thermal grease for easy installation
  • 100 W/mK thermal conductivity for high heat transfer
  • Operates reliably from 10 °C to 140 °C

Conductonaut LMTG-100 liquid metal thermal paste

UPSIREN Conductonaut LMTG-100 is a non-conductive liquid metal thermal compound packaged in a 1.0g syringe. It uses polymer microcapsules to encapsulate the liquid metal, preventing oxidation while maintaining a thermal conductivity of 100W/Mk. The paste applies like standard silicone grease and operates from 10 °C to 140°C.

Builders who want liquid metal performance without

This compound suits users seeking ultra-low thermal resistance on CPUs or GPUs where accidental spills could damage components. It is not for installations requiring large-volume application across multiple dies, nor for situations where the paste will be rubbed aggressively during mounting, as violent rubbing damages the microcapsules.

1.0g syringe covers a single CPU or GPU die

The 1.0g volume provides enough material for one standard processor lid or graphics die with a thin, even layer. It comfortably handles high-heat loads up to the 140°C long-term limit. It runs out when covering larger server heatspreaders or when reapplied frequently, as the small syringe does not support multiple full builds.

Ciri-ciri utama

  • Non-conductive formula prevents motherboard short circuits
  • Polymer microcapsules block oxidation for lasting performance
  • Applies like standard thermal grease for easy installation
  • 100 W/mK thermal conductivity for high heat transfer
  • Operates reliably from 10 °C to 140 °C

Spesifikasi

BrandUPSIREN
SeriesConductonaut
Volume / Net Weight1.0g
Thermal Conductivity100W/Mk
Long Term Operating Temperature10 °C -140°C

Soalan tentang produk ini

Does my CPU cooler need a copper or nickel-plated cold plate for the Conductonaut LMTG-100 paste?

Yes, use only with copper or nickel-plated bases; liquid metal alloys will corrode bare aluminium cold plates.

Will the 100 W/m·K conductivity still benefit my older CPU with a larger die and thicker integrated heat spreader?

The ultra-low thermal resistance improves heat transfer even on larger dies, lowering core temperatures versus conventional pastes.

How can I verify the 1.0 g syringe is performing correctly after application?

Monitor CPU core temperatures under sustained load; they should stabilise well within the 10 °C to 140 °C operating range.

Juga di rak ini

Pelanggan turut membandingkan

Rak yang sama, checkout yang sama — lapan koin kripto dan kunci kadar 30 minit.