UPSIREN
UPSIREN Conductonaut LMTG-100 liquid metal thermal paste 1.0g 100W/Mk
Non-conductive liquid-metal microcapsule paste with 100 W/mK conductivity for CPU and GPU cooling from 10 °C to 140 °C
- Volume / Net Weight1.0g
- Thermal Conductivity100W/Mk
- Long Term Operating Temperature10 °C -140°C
- Non-conductive formula prevents motherboard short circuits
- Polymer microcapsules block oxidation for lasting performance
- Applies like standard thermal grease for easy installation
- 100 W/mK thermal conductivity for high heat transfer
- Operates reliably from 10 °C to 140 °C
Conductonaut LMTG-100 liquid metal thermal paste
UPSIREN Conductonaut LMTG-100 is a non-conductive liquid metal thermal compound packaged in a 1.0g syringe. It uses polymer microcapsules to encapsulate the liquid metal, preventing oxidation while maintaining a thermal conductivity of 100W/Mk. The paste applies like standard silicone grease and operates from 10 °C to 140°C.
Builders who want liquid metal performance without
This compound suits users seeking ultra-low thermal resistance on CPUs or GPUs where accidental spills could damage components. It is not for installations requiring large-volume application across multiple dies, nor for situations where the paste will be rubbed aggressively during mounting, as violent rubbing damages the microcapsules.
1.0g syringe covers a single CPU or GPU die
The 1.0g volume provides enough material for one standard processor lid or graphics die with a thin, even layer. It comfortably handles high-heat loads up to the 140°C long-term limit. It runs out when covering larger server heatspreaders or when reapplied frequently, as the small syringe does not support multiple full builds.
Besonderheiten
- Non-conductive formula prevents motherboard short circuits
- Polymer microcapsules block oxidation for lasting performance
- Applies like standard thermal grease for easy installation
- 100 W/mK thermal conductivity for high heat transfer
- Operates reliably from 10 °C to 140 °C
Technische Daten
| Brand | UPSIREN |
|---|---|
| Series | Conductonaut |
| Volume / Net Weight | 1.0g |
| Thermal Conductivity | 100W/Mk |
| Long Term Operating Temperature | 10 °C -140°C |
Fragen zu diesem Artikel
Does my CPU cooler need a copper or nickel-plated cold plate for the Conductonaut LMTG-100 paste?
Yes, use only with copper or nickel-plated bases; liquid metal alloys will corrode bare aluminium cold plates.
Will the 100 W/m·K conductivity still benefit my older CPU with a larger die and thicker integrated heat spreader?
The ultra-low thermal resistance improves heat transfer even on larger dies, lowering core temperatures versus conventional pastes.
How can I verify the 1.0 g syringe is performing correctly after application?
Monitor CPU core temperatures under sustained load; they should stabilise well within the 10 °C to 140 °C operating range.
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