UPSIREN Conductonaut LMTG-100 liquid metal thermal paste 1.0g 100W/Mk

Conductonaut LMTG-100 liquid metal thermal paste

UPSIREN Conductonaut LMTG-100 is a non-conductive liquid metal thermal compound packaged in a 1.0g syringe. It uses polymer microcapsules to encapsulate the liquid metal, preventing oxidation while maintaining a thermal conductivity of 100W/Mk. The paste applies like standard silicone grease and operates from 10 °C to 140°C.

Builders who want liquid metal performance without

This compound suits users seeking ultra-low thermal resistance on CPUs or GPUs where accidental spills could damage components. It is not for installations requiring large-volume application across multiple dies, nor for situations where the paste will be rubbed aggressively during mounting, as violent rubbing damages the microcapsules.

1.0g syringe covers a single CPU or GPU die

The 1.0g volume provides enough material for one standard processor lid or graphics die with a thin, even layer. It comfortably handles high-heat loads up to the 140°C long-term limit. It runs out when covering larger server heatspreaders or when reapplied frequently, as the small syringe does not support multiple full builds.