Dynatron
Dynatron B4A CPU Cooler FCLGA 3647 Narrow ILM 1U 205W
Cools Intel Xeon processors up to 205 W in 1U servers using a copper vapor-chamber heatsink with pre-applied thermal grease
- TypeHeatsinks only
- CPU Socket CompatibilityIntel FCLGA 3647 Narrow ILM
- Heatsink MaterialCopper1100 Stacked Fin Heatsink with Vapor Chamber Base
- Heatsink Dimensions108.0 x 81.0 x 27.0 mm
- Weight480 g
- FeaturesIntel Xeon Platinum / Gold Family Processor, (products forme
- Vapor chamber base moves heat rapidly from the CPU
- Copper1100 stacked fins spread heat across a large surface
- 205 W thermal capacity handles high-power Xeon processors
- 1U profile fits dense server chassis at 27.0 mm tall
- Shin-Etsu 7762 paste pre-applied for quick installation
Socket-Specific 1U Server Cooler
The Dynatron B4A is a copper heatsink designed for Intel FCLGA 3647 Narrow ILM sockets in 1U server chassis. It uses a Copper1100 stacked fin array with a vapor chamber base and ships with Shin-Etsu 7762 thermal grease pre-applied. The unit measures 108.0 x 81.0 x 27.0 mm and weighs 480 g.
1U Xeon Builds Up to 205W
This cooler suits administrators deploying Intel Xeon Platinum or Gold processors, formerly Skylake, within the 205W thermal envelope of a 1U form factor. It does not suit builds requiring active fan cooling, larger heatsink heights, or sockets other than FCLGA 3647 Narrow ILM.
205W Thermal Limit in 1U Height
The decisive specification is the 205W cooling capacity within a 27.0 mm stack height, matching the narrow ILM mechanical layout. Exceeding this power rating or using a different socket interface will prevent correct installation and thermal performance.
Puncte forte
- Vapor chamber base moves heat rapidly from the CPU
- Copper1100 stacked fins spread heat across a large surface
- 205 W thermal capacity handles high-power Xeon processors
- 1U profile fits dense server chassis at 27.0 mm tall
- Shin-Etsu 7762 paste pre-applied for quick installation
Specificații
| Brand | Dynatron |
|---|---|
| Model | B4A |
| Type | Heatsinks only |
| CPU Socket Compatibility | Intel FCLGA 3647 Narrow ILM |
| Heatsink Material | Copper1100 Stacked Fin Heatsink with Vapor Chamber Base |
| Heatsink Dimensions | 108.0 x 81.0 x 27.0 mm |
| Weight | 480 g |
| Features | Intel Xeon Platinum / Gold Family Processor, (products formerly Skylake ), Socket FCLGA3647, Narrow ILM, Copper Heatsink with Vapor Chamber Base for 1U Server up to CPU power 205 Watts. CPU Support: Intel CPU Socket: FCLGA 3647 Narrow ILM Solution: 1U Server and Up Material: Copper1100 Stacked Fin Heatsink with Vapor Chamber Base Thermal Grease: Shin-Etsu 7762 Pre-Applied |
| Greutate la expediere | 0.55 kg |
| Dimensiunile coletului | 136 × 112 × 3 mm |
Întrebări despre acest articol
How much heat can the 205 W rating actually dissipate inside a 1U server?
The vapor-chamber base and copper 1100 stacked fins are rated to handle up to 205 W of CPU power in a 1U chassis.
Does the FCLGA 3647 Narrow ILM mounting limit which Xeon processors fit?
It fits only Xeon Platinum and Gold CPUs that use the Narrow ILM variant of the FCLGA 3647 socket.
Will the 108.0 x 81.0 x 27.0 mm heatsink clear standard 1U case lids and DIMM slots?
At 27.0 mm tall it is built for 1U height limits, and the 81.0 mm width avoids DIMM interference on narrow-ILM boards.
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