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Two black DDR5 modules with RGB lighting and heat spreaders

Kingston Technology Corp.

Kingston Technology Corp. KF560C30BBEAK2-64 FURY Beast 64GB (2×32GB) DDR5 6000 CL30 desktop RAM

SKU CH-T5BC-NK3GP MPN KF560C30BBEAK2-64

64 GB dual-channel DDR5 kit at 6000 MT/s with CL30 timing, 1.40 V, RGB lighting and both Intel XMP 3.0 and AMD EXPO profiles

  • Capacity64GB (2 x 32GB)
  • Type288-Pin PC RAM
  • SpeedDDR5 6000 (PC5 48000)
  • CAS LatencyCL30
  • Timing30-36-36
  • Voltage1.40V

Capacity 64GB (2 x 32GB)

Speed DDR5 6000 (PC5 48000)

CAS Latency CL30

Color Black

  • Black
  • White
  • Silver / Black
  • Silver / White

Versiunile tăiate există, dar nu sunt disponibile aici.

  • 64GB total capacity with two 32GB modules
  • DDR5 6000 speed for high bandwidth performance
  • CL30 latency with 30-36-36 timing for responsive operation
  • Intel XMP 3.0 and AMD EXPO profiles for easy optimisation
  • Black heat spreader with RGB lighting for thermal management and style

Capacity and purpose

This Kingston FURY Beast kit delivers 64GB of DDR5 memory in two 32GB modules. It targets desktop builders who need high capacity for gaming or heavy multitasking on AMD Ryzen or Intel platforms. The dual-channel configuration ensures balanced bandwidth across both sticks.

Thermals and power

Each module carries a black heat spreader to move heat away from the DRAM. Operating voltage is set at 1.40V to sustain the rated DDR5 6000 speed. No active cooling is included so airflow inside the case handles the thermal load.

Profile support

The kit supports both Intel XMP 3.0 and AMD EXPO 1.1 profiles for one-click overclocking to CL30 30-36-36 timings. Enabling the appropriate profile in the BIOS sets the correct frequency, latency and voltage automatically.

Puncte forte

  • 64GB total capacity with two 32GB modules
  • DDR5 6000 speed for high bandwidth performance
  • CL30 latency with 30-36-36 timing for responsive operation
  • Intel XMP 3.0 and AMD EXPO profiles for easy optimisation
  • Black heat spreader with RGB lighting for thermal management and style

Specificații

BrandKingston
SeriesFURY Beast
ModelKF560C30BBEAK2-64
Capacity64GB (2 x 32GB)
Type288-Pin PC RAM
SpeedDDR5 6000 (PC5 48000)
CAS LatencyCL30
Timing30-36-36
Voltage1.40V
Multi-channel KitDual Channel Kit
BIOS/Performance ProfileIntel XMP 3.0 and AMD EXPO
ColorBlack
Heat SpreaderYes
FeaturesKingston FURY KF560C30BBEAK2-64 is a kit of two 4G x 64-bit (32GB) DDR5-6000 CL30 SDRAM (Synchronous DRAM) 2Rx8, memory module, based on sixteen 2G x 8-bit FBGA components per module. Each module kit supports AMD® EXPO v1.1 and Intel® Extreme Memory Profiles (Intel® XMP) 3.0. Total kit capacity is 64GB
Recommend UseAMD & Intel Compatible / AMD 500 Series / AMD 600 Series / AMD B550 / AMD B650 / AMD Ryzen Compatible / AMD X570 / AMD X670 / High Performance or Gaming Memory / Intel 500 Series / Intel 600 Series / Intel 700 Series / Intel B660 / Intel B670 / Intel Z590 / Intel Z690 / Intel Z790
LED ColorRGB
Greutate la expediere0.09 kg
Dimensiunile coletului169 × 121 × 15 mm

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Întrebări despre acest articol

How do I install the 288-pin DDR5 modules and enable the 6000 speed, and what step do people often miss?

Align the notch on each 32GB module with the motherboard slot key, press firmly until the retention clips click on both sides, then enter the BIOS and enable the Intel XMP 3.0 or AMD EXPO v1.1 profile so the kit runs at its rated 6000 MT/s instead of the default JEDEC speed.

What maintenance or replacement will the 64GB dual-channel kit need over time?

The black aluminium heat spreader on each module requires no service; simply clean dust from the fins with compressed air during routine PC cleaning. The DDR5 SDRAM itself has no user-replaceable parts, so replacement is only necessary if a module fails or a capacity upgrade is desired.

What limit appears first when the 1.40V CL30 2Rx8 modules run under sustained heavy load?

The primary limit is thermal; the 1.40V operating voltage and dense 2Rx8 layout generate heat that the spreader must dissipate. If case airflow is insufficient, the modules can reach their thermal throttle point before any electrical or timing constraint becomes the bottleneck.

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