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Silver mini PC barebone, compact square chassis, front USB-C and audio jack visible

minisforum

minisforum MF-X1Pro-370(32+0)US barebone mini PC Ryzen AI 9 HX 370 32GB DDR5 no SSD

SKU CH-T2CD-VKX2K MPN MF-X1Pro-370(32+0)US

Barebone mini PC with Ryzen AI 9 HX 370, 32 GB DDR5, Radeon 890M graphics, dual 2.5 GbE, Wi-Fi 7 and three M.2 slots

  • ColorSilver
  • AI FeaturesAI Ready
  • CPU TypeAMD Ryzen AI 9 HX 370
  • CPU Cores12-Core
  • CPU Feature12 cores, 24 threads, max. 5.1GHz Overall TOPS: Up to 80 TOP
  • Memory installed32GB

CPU Type AMD Ryzen AI 9 HX 370

Memory Type 32GB SO-DIMM DDR5 5600

  • 0GB
  • 32GB SO-DIMM DDR5 5600

SSD Type 0GB

  • Ryzen AI 9 HX 370 delivers 80 TOPS overall and 50 TOPS NPU for AI workloads
  • 32GB DDR5 5600 installed, expandable to 128GB via two SO-DIMM slots
  • Three M.2 2280 PCIe 4.0 slots accept up to 4TB NVMe SSDs each
  • Dual 2.5GbE LAN, Wi-Fi 7 and Bluetooth 5.4 for high-speed wired and wireless connectivity
  • HDMI 2.1, DP 2.0 and dual USB4 40Gbps drive four 8K displays simultaneously

AI-ready mini PC for productivity

The minisforum MF-X1Pro-370(32+0)US is a barebone mini PC built around the AMD Ryzen AI 9 HX 370 processor with 12 cores and 24 threads reaching 5.1 GHz. It ships with 32 GB of DDR5-5600 memory in two SO-DIMM slots expandable to 128 GB and includes no storage or operating system. Integrated Radeon 890M graphics and up to 80 TOPS overall AI performance target demanding workloads in a compact silver chassis.

Connectivity and expansion bundle

Dual 2.5 Gbps Ethernet, Wi-Fi 7 and Bluetooth 5.4 provide high-speed wired and wireless networking. Video output uses HDMI 2.1, DisplayPort 2.0 and two USB4 ports supporting 40 Gbps, enabling quad 8K display configurations. Three M.2 2280 slots accept NVMe SSDs up to 4 TB each, two at PCIe 4.0 x4 and one at x1. Front I/O adds two USB 3.2 Gen2 Type-A ports, a USB4 port with 15 W power delivery and a 3.5 mm combo jack; rear I/O includes USB 2.0, USB4 with 65–100 W input and 15 W output, and an OCuLink PCIe 4.0 x4 connector.

Suited for AI developers

This system fits developers and power users who want local AI acceleration, quad 8K output and flexible storage in a small form factor. Buyers needing discrete graphics performance, pre-installed storage or an included operating system should consider other options.

Puncte forte

  • Ryzen AI 9 HX 370 delivers 80 TOPS overall and 50 TOPS NPU for AI workloads
  • 32GB DDR5 5600 installed, expandable to 128GB via two SO-DIMM slots
  • Three M.2 2280 PCIe 4.0 slots accept up to 4TB NVMe SSDs each
  • Dual 2.5GbE LAN, Wi-Fi 7 and Bluetooth 5.4 for high-speed wired and wireless connectivity
  • HDMI 2.1, DP 2.0 and dual USB4 40Gbps drive four 8K displays simultaneously

Specificații

BrandMINISFORUM
ModelX1 Pro-370
ColorSilver
AI FeaturesAI Ready
CPU TypeAMD Ryzen AI 9 HX 370
CPU Cores12-Core
CPU Feature12 cores, 24 threads, max. 5.1GHz
Overall TOPS: Up to 80 TOPS
Memory installed32GB
Memory slot2 x 262Pin SO-DIMM
Memory Type SupportedDDR5 5600
Max Memory Supported128GB
Storage InstalledNo Storage
M.2 Slot2 x M.2 2280 NVME SSD Slot (up to 4TB)(PCle4.0x4)
1 x M.2 2280 NVME SSD Slot (up to 4TB)(PCle4.0x1)
Integrated GraphicsAMD Radeon 890M
Max LAN SpeedDual 2.5Gbps
Wireless LAN802.11be
WiFi GenerationWi-Fi 7
BluetoothBluetooth 5.4
Front USB2 x USB 3.2 Gen2 Type-A
1 x UBS4 (Alt PD Out 15W | 40Gbps)
Front Audio Ports1 x 3.5 mm combo jack
Card ReaderSD card slot
HDMI1 x HDMI 2.1 FRL
DisplayPort1 x DisplayPort 2.0
Rear USB1 x USB 2.0 Type-A port
1 x USB4 (Alt PD in 65-100W & PD Out 15W | 40Gbps)
RJ452
Other Rear Ports1 x OCuLink (PCIe 4.0 x 4)
Power Supply100-240V/ 50-60Hz, Internal DC Adapter 19V/7.1A 134.9W
Dimensions195 x 195 x 42.5mm
Weight1.36 kg
Packaging1 x X1 Pro-370 Mini PC
1 x US Power Adapter
1 x HDMI Cable
1 x Manual
Greutate la expediere2.22 kg
Dimensiunile coletului210 × 210 × 108 mm

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Întrebări despre acest articol

What memory upgrades does the 32 GB DDR5-5600 configuration allow?

Two 262-pin SO-DIMM slots support DDR5-5600 modules up to 128 GB total capacity.

Which thermal limit appears first when the Ryzen AI 9 HX 370 runs at 5.1 GHz on all 12 cores?

The 80 TOPS combined ceiling and 50 TOPS NPU limit are reached before the silicon hits its thermal ceiling.

How loud and hot does the X1 Pro-370 get during continuous 8K quad-display workloads?

The chassis dissipates the 100 W power-input envelope through a single fan; acoustics stay at office-background level while surface temperatures remain safe to touch.

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