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Square thermoelectric Peltier module with heatsink, 40mm

New Ocean Tech

New Ocean Tech TEC1-12715 40mm Thermoelectric CPU Cooler

SKU CH-JJN1-35CSE

A 40 mm thermoelectric module with a 12715 Peltier plate and integrated heatsink for active CPU cooling

  • Thermoelectric cooling enables sub-ambient CPU temperatures
  • 40 mm square footprint fits tight socket clearances
  • Peltier plate design moves heat without moving parts
  • Model TEC1-12715 rated for direct die contact

Thermoelectric cooler for CPU heat removal

The New Ocean Tech TEC1-12715 is a 40mm Peltier module designed to move heat away from a processor using the thermoelectric effect. It suits enthusiasts building custom liquid loops or direct-die cooling rigs who need active temperature control beyond passive heatsinks. Buyers looking for a drop-in air cooler with an integrated fan will not find that here.

Aluminium heatsink base with ceramic Peltier element

The sandwich construction pairs an aluminium cold plate to the ceramic 12715 module for thermal transfer. Two bare wire leads exit the side for direct connection to a suitable DC power source. No mounting brackets, thermal paste or insulation pads are included, so the builder must supply a clamping mechanism and moisture protection before powering the device.

Puncte forte

  • Thermoelectric cooling enables sub-ambient CPU temperatures
  • 40 mm square footprint fits tight socket clearances
  • Peltier plate design moves heat without moving parts
  • Model TEC1-12715 rated for direct die contact

Specificații

Nicio specificație publicată pentru acest articol deocamdată.

Întrebări despre acest articol

Does the TEC1-12715 module use a standard electrical interface that limits its voltage or current?

The module operates on direct current; practical limits depend on the power supply you provide and the thermal load you apply.

What are the physical dimensions and mounting requirements for the 40mm heatsink assembly?

The cold plate measures 40 by 40 millimetres and requires a flat mounting surface with thermal paste and even clamping pressure.

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