A-Tech 256GB (4x64GB) DDR4 2666 ECC LRDIMM 4Rx4 Server RAM
- 256GB (4 x 64GB)
- DDR4 2666 (PC4 2130…
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A-Tech
A 256 GB quad-channel kit of four 64 GB DDR4 2666 MHz ECC registered DIMMs with CL19 latency and 1.2 V operation
Capacity 256GB (4 x 64GB)
This 256 GB quad-channel kit contains four 64 GB registered ECC DIMMs built for DDR4 2666 servers and workstations. The modules operate at the standard 1.20 V and present a 2S2Rx4 quad-rank 3DS layout that multi-socket platforms expect. Desktop or laptop boards cannot use this memory.
Each DIMM runs at the JEDEC 1.20 V DDR4 voltage so power draw stays within the server platform's thermal budget. Registered buffering reduces electrical load on the memory controller, helping keep signal integrity stable under sustained workloads. No active cooling is required beyond the chassis airflow the system already provides.
Major-brand chips on a 288-pin RDIMM PCB undergo full quality-assurance testing before shipping. The quad-rank 3DS/TSV organisation means each module presents four logical ranks, so the host must support 4Rx4 population rules and correct channel seating order. Verify the platform manual for supported rank-per-channel limits and slot-filling sequences before installation.
| Brand | A-Tech |
|---|---|
| Series | A-Tech DDR4 Server Memory RAM |
| Model | A-Tech 64GB 2S2Rx4 PC4-2666V-R |
| Capacity | 256GB (4 x 64GB) |
| Speed | DDR4 2666 (PC4 21300) |
| CAS Latency | CL19 |
| Voltage | 1.20V |
| ECC | Yes |
| Buffered/Registered | Registered |
| Rank | 2S2Rx4 (4Rx4 3DS/TSV) |
| Multi-channel Kit | Quad Channel Kit |
| Chipset | Major Brand Chipset |
| Features | Major Brand Chips |
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Power down the server, open the chassis, align each 64 GB module's notch with the slot key, press firmly until the ejector clips lock on both sides, then verify in BIOS that all four channels report 2666 MHz at CL19.
No routine maintenance is required; the modules run at 1.20 V with major-brand chips and ECC error correction, so replacement only occurs if a module fails or a future platform upgrade demands a different memory generation.
The four quad-rank 3DS modules place maximum electrical load on each memory channel, so the platform's memory controller typically hits its rank-per-channel limit before thermal or bandwidth ceilings become a factor.
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