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Spremljani izdelki Prijava
Black tower gaming desktop with tempered glass side panel and liquid cooling visible inside

Adamant Custom

Adamant Custom Core Ultra 9 285K RTX 5080 64GB DDR5 1TB NVMe gaming PC

SKU CH-6H6Y-BJ0GH

Tower gaming desktop with 24-core Intel Core Ultra 9 285K, 64GB DDR5, 1TB NVMe and RTX 5080 16GB GPU, liquid cooled, Windows 11 Pro

  • Release Year2026
  • Form FactorTower
  • AI FeaturesAI Ready
  • ColorBlack
  • Cooling SystemLiquid Cooling
  • Operating SystemWindows 11 Pro
  • 24-core Intel Core Ultra 9 285K drives heavy AI and rendering workloads
  • GeForce RTX 5080 16GB accelerates 3D modelling and high-resolution gaming
  • 64GB DDR5 memory handles large datasets with headroom to 192GB
  • Samsung 990 PRO 1TB NVMe delivers 7450 MB/s read and 6900 MB/s write speeds
  • 360mm liquid cooler and 1000W 80 PLUS Gold PSU keep thermals and power stable under load

Purpose-built workstation

This desktop combines a 24-core Intel Core Ultra 9 285K processor with 64GB DDR5 memory and an Nvidia GeForce RTX 5080 16GB graphics card. It targets professionals who need local compute for rendering, modelling and AI learning workloads. The system ships with Windows 11 Pro and a 1TB Samsung 990 PRO NVMe drive. Buyers who need more than 1TB of fast storage or a second GPU will need a different platform.

Thermals and power

A 360mm quiet-edition liquid cooler handles the CPU while the case uses two 140mm PWM front fans for airflow. The Thermaltake Toughpower 1000W 80 PLUS Gold unit supplies power with Japanese main capacitors and protections for over-voltage, under-voltage, over-power and short-circuit. In typical workloads the liquid loop keeps the 24-core chip at stable temperatures without excessive fan speed. The 1000W rating covers the full component set with headroom.

Bundled hardware impact

The Gigabyte Z890M AORUS motherboard adds rear USB4 Type-C, 2.5Gb Ethernet, Wi-Fi 7 and Bluetooth5.4 plus internal M.2 and SATA expansion. Samsung 990 PRO sequential reads reach 7450 MB/s and writes 6900 MB/s, cutting project load times. Four total memory slots support up to 192GB DDR5 for future upgrades. Front-panel USB 3.2 Gen 2x2 Type-C gives quick access to external drives.

Poudarki

  • 24-core Intel Core Ultra 9 285K drives heavy AI and rendering workloads
  • GeForce RTX 5080 16GB accelerates 3D modelling and high-resolution gaming
  • 64GB DDR5 memory handles large datasets with headroom to 192GB
  • Samsung 990 PRO 1TB NVMe delivers 7450 MB/s read and 6900 MB/s write speeds
  • 360mm liquid cooler and 1000W 80 PLUS Gold PSU keep thermals and power stable under load

Specifikacije

Release Year2026
Form FactorTower
AI FeaturesAI Ready
ColorBlack
Cooling SystemLiquid Cooling
Operating SystemWindows 11 Pro
Windows 11Ready
CPU TypeIntel Core Ultra 9 (Series 2)
CPU NameIntel Core Ultra 9 285K
CPU Socket TypeLGA 1851
GPU/VGA TypeGeForce RTX 5080
Memory Capacity64GB DDR5
Memory Slots (Available/Total)4 total
Maximum Memory Supported192 GB
SSD1TB NVMe
HDDNo
Optical Drive TypeNo
Screen SizeNo Screen
Audio ChipsetIntegrated
Audio Channels7.1 channels
LAN ChipsetIntegrated
LAN Speed2.5Gbps
WLAN802.11be Wireless LAN
WiFi GenerationWi-Fi 7
BluetoothBluetooth 5.4
RJ451 port

Vprašanja o tem izdelku

How is the 360 mm liquid cooler mounted and what step do builders often skip?

The 360 mm AIO arrives pre-filled and attached to the CPU block; the step people miss is screwing the radiator fans onto the radiator before fitting the assembly into the case roof, otherwise the fans sit loose and airflow drops.

Which component will need replacement first under heavy workloads and when?

The pump in the 360 mm AIO is the wear item; expect three to five years of continuous load before flow rate falls enough to raise CPU temperatures, at which point the whole cooler is swapped.

What thermal limit appears first when the Core Ultra 9 285K runs at 5.70 GHz for hours?

The 360 mm radiator surface area saturates first; coolant temperature climbs until the fan curve hits maximum RPM, after which the CPU throttles to stay within its thermal envelope.

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