AMD EPYC 9474F 48-Core 3.6 GHz Server Processor 100-000000788
- EPYC 9474F
- Socket SP5
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AMD
48-core server processor with 2.75 GHz base clock, 3.8 GHz max turbo, 256 MB L3 cache, 12-channel DDR5 support and 128 PCIe 5.0 lanes
Option EPYC 9454
The AMD EPYC 9454 is a 48-core server processor built for high-density compute environments. It targets operators running virtualised infrastructure, large databases or AI training clusters that demand maximum thread count per socket. The SP5 platform provides twelve memory channels and 128 PCIe 5.0 lanes for balanced I/O.
The 256 MB L3 cache feeds 96 threads with low-latency data, keeping utilisation high on memory-bound workloads. Twelve DDR5 4800 channels deliver aggregate bandwidth that sustains large working sets without stalling. The 290 W TDP marks the thermal ceiling; sustained all-core loads will sit at the 2.75 GHz base frequency rather than the 3.8 GHz single-core boost.
This processor only fits motherboards with the SP5 socket and supporting infrastructure for 12-channel DDR5 and 128 lanes of PCIe 5.0. Existing SP3 or consumer platforms cannot accept it. Buyers without a qualified SP5 server board and adequate cooling for 290 W should not purchase this CPU.
| Brand | AMD |
|---|---|
| Series | AMD EPYC 9004 |
| Name | EPYC 9454 |
| Model | 100-000000478 |
| CPU Socket Type | Socket SP5 |
| # of Cores | 48-Core |
| # of Threads | 96 |
| Operating Frequency | 2.75 GHz |
| Max Turbo Frequency | 3.8 GHz |
| L3 Cache | 256MB |
| 64-Bit Support | Yes |
| Integrated Memory Controller Speed | DDR5 4800 |
| Memory Channel | 12 Channel |
| PCI Express Revision | 5.0 |
| Max # of PCI Express Lanes | 128 |
| Thermal Design Power | 290W |
| Cooling Device | Cooling device not included - Processor Only |
| Teža pošiljke | 0.23 kg |
| Velikost pošiljke | 184 × 152 × 86 mm |
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No, this CPU requires the SP5 socket and will not fit SP3 motherboards.
Check the operating system task manager or run lscpu to confirm 48 cores and 96 threads are detected.
The processor ships without a cooling device; a compatible SP5 heatsink and thermal interface material must be purchased separately.
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