BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
- Rackmount
Sprejemamo kriptovalute — tako lahko sredstva, ki jih imate, kupijo pravo strojno opremo.Plačajte v kriptovaluti, zapravite jo za pravo strojno opremo. Brezplačna zavarovana dostava po vsem svetu nad 399 $. Nevtralni kartoni brez znamke, poslani iz Nemčije.Brezplačna zavarovana dostava nad 399 $. Vaš tečaj je zaklenjen za 30 minut, takoj ko se odpre blagajna.Tečaj zaklenjen 30 minut. Vsak izdelek je zapečaten, njegova serijska številka preverjena, in krit z 24-mesečno garancijo.Zapečateno, 24-mesečna garancija.
ASUS
Bundled AM5 motherboard and Ryzen 7 9850X3D processor deliver 14+2+1 80A power stages, PCIe 5.0 M.2, Wi-Fi 7, 2.5Gb LAN and 600W GPU slot for high-performance gaming builds
This ASUS TUF GAMING B850-BTF WIFI W motherboard is paired with an AMD Ryzen 7 9850X3D processor. The board uses the AMD B850 chipset and AM5 socket, supporting Ryzen 7000, 8000 and 9000 series CPUs. It targets gamers and content creators who want a ready-to-run platform with high-end connectivity and power delivery.
The combo replaces a separate motherboard and CPU purchase, delivering a 14+2+1 80A DrMOS power design and PCIe 5.0 x16 slot in one step. The jump is worth it when you need the 2nd-gen AMD 3D V-Cache gaming advantage of the 9850X3D, Wi-Fi 7, 2.5Gb Ethernet and a graphics-card high-power slot rated for 600 watts through the board.
Verify that your case fits an ATX motherboard and provides clearance for enlarged VRM heatsinks and three M.2 heatsinks. Confirm your power supply includes the connectors required for the 600-watt graphics-card high-power slot and the 20Gbps rear USB Type-C port. Ensure your CPU cooler mounts on the AM5 socket pattern.
| Brand | ASUS |
|---|---|
| Model | TUF GAMING B850-BTF WIFI W +R7 9850X3D |
| CPU Socket Type | AM5 |
The TUF GAMING B850-BTF WIFI W follows the ATX form factor, so any case that accepts ATX motherboards will accommodate it.
Align the gold triangle on the CPU with the socket marker, lower the chip gently without pressure, then flip the retention arm down until it clicks — forcing the arm risks bent pins.
Use compressed air to clear dust from the M.2 and VRM heatsinks every six to twelve months, depending on case airflow, to keep thermal performance consistent.
Tudi v tem oddelku
Ista polica, ista blagajna — osem kriptovalut in 30-minutni zaklep tečaja.
V čem plačujete in v čem berete cene.
Poslano iz Vaše denarnice ob blagajni
Samo za prikaz — katalog je cenovno izražen v dolarjih
Nobena valuta ne ustreza.
Izberite jezik, v katerem Vam govori spletna stran.
Ni ustreznega jezika.
Prvič tu?
Že imate račun?
Samodejne ponastavitve ni: ta trgovina ne pošilja e-pošte, zato ni enkratne povezave, ki bi jo lahko zahtevali. Pustite naslov na računu — nekdo ga bo obravnaval ročno.
Zahteva zabeležena
V Vašo elektronsko pošto ne prihaja nič — ta trgovina ne pošilja nobene e-pošte. Zahteve nekdo obravnava ročno.
Ste se spomnili?