Corn Electronics R4I SDHC Dual Core Gold Pro 2018 Card Reader
- 1 card
- Black
Sprejemamo kriptovalute — tako lahko sredstva, ki jih imate, kupijo pravo strojno opremo.Plačajte v kriptovaluti, zapravite jo za pravo strojno opremo. Brezplačna zavarovana dostava po vsem svetu nad 399 $. Nevtralni kartoni brez znamke, poslani iz Nemčije.Brezplačna zavarovana dostava nad 399 $. Vaš tečaj je zaklenjen za 30 minut, takoj ko se odpre blagajna.Tečaj zaklenjen 30 minut. Vsak izdelek je zapečaten, njegova serijska številka preverjena, in krit z 24-mesečno garancijo.Zapečateno, 24-mesečna garancija.
Corn Electronics
Aluminium alloy heatsinks with thermal pads and screws cool DDR5 memory modules
Option Black
This pair of aluminium-alloy memory vests is designed for DDR5 modules that run hot under sustained load. Each vest measures 134 mm long, 8 mm wide and 34 mm tall and uses an anodised blasted finish to maximise surface area. Six thermal pads and six mounting screws are included for a secure, tool-friendly fit. The low-profile design keeps clearance tight for most CPU coolers.
Stock DDR5 sticks often rely on thin spreaders that saturate quickly during long renders or heavy multitasking. Adding these vests moves heat into aluminium mass and open fins, lowering peak temperatures without active airflow. The improvement is most noticeable when memory is overclocked or when case ventilation is limited. Builders running modules at stock speeds with good case flow will see less benefit.
The vests clamp directly onto the module PCB using the supplied hardware, so no motherboard headers or power connections are required. Ensure the 34 mm height clears your CPU cooler or liquid-cooling block before ordering. The 8 mm width fits standard dual-slot spacing, but extremely tall heatspreaders on adjacent modules may interfere. Thermal pads must be applied cleanly for best contact.
| Type | Heatsinks only |
|---|
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Each vest is 134mm long and 34mm tall; measure the gap between your memory slots and the CPU cooler to confirm clearance.
Place a silicon pad on each memory IC, set the aluminum vest over it, then secure with the three screws per side — the step most people miss is tightening the screws evenly so pressure stays uniform.
Replace the pads if they become brittle, lose tackiness, or if you remount the vests on different modules; fresh pads ensure full contact and consistent heat transfer.
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