BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
- Rackmount
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G.SKILL
Dual-channel 16 GB DDR3 2400 kit with CL11 timing, 1.65 V operation and a 3.2 cm low-profile heat spreader
This G.SKILL Ares Series kit delivers 16 GB of DDR3 memory in two 8 GB modules running at 2400 MT/s with CL11 11-13-13-31 timings at 1.65 V. The low-profile heat spreader measures 3.2 cm tall and is finished in blue.
The dual-channel kit suits 3rd and 4th Generation Intel Core platforms that support DDR3 2400 and Intel XMP 1.3. Systems requiring ECC, registered modules, or a different DDR generation should choose another product.
Insert the 240-pin DIMMs into the motherboard slots and enable the XMP profile in the BIOS to reach rated speed. The low profile avoids clearance issues with large CPU coolers, while the 1.65 V requirement must be supported by the platform.
| Brand | G.SKILL |
|---|---|
| Series | Ares Series |
| Model | F3-2400C11D-16GAB |
| Capacity | 16GB (2 x 8GB) |
| Type | 240-Pin PC RAM |
| Speed | DDR3 2400 (PC3 19200) |
| CAS Latency | CL11 |
| Timing | 11-13-13-31 |
| Voltage | 1.65V |
| ECC | No |
| Buffered/Registered | Unbuffered |
| Multi-channel Kit | Dual Channel Kit |
| Color | Blue |
| Heat Spreader | Yes |
| Features | Low profile heat spreader for better compatibility with extra large CPU coolers Compatible with 3rd & 4th Generation Intel Core Processors Intel XMP 1.3 support Please check gskill.com for motherboard compatibility chart To reach rated memory speed, enabling Intel XMP profile or manual BIOS tuning is required |
| Teža pošiljke | 0.11 kg |
| Velikost pošiljke | 216 × 135 × 17 mm |
Yes, the modules are 240-pin DDR3 DIMMs and require a motherboard with matching DDR3 slots.
At 3.2 cm tall the Ares spreader is designed to fit under oversized CPU coolers and in small-form-factor cases.
Enable Intel XMP 1.3 in the BIOS; the firmware will then set 2400 MT/s with 11-13-13-31 timings at 1.65 V.
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