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Spremljani izdelki Prijava

GUDGA

GUDGA DDR5 16GB 6400MHz CL46 Desktop RAM

SKU CH-TSG5-H1FEN

A 16 GB DDR5 desktop module running at 6400 MHz with CL46 latency and a 1.25 V aluminium-heatsink design

  • Capacity8GB
  • SpeedOther
  • CAS LatencyCL40
  • Timing40-40-40-77
  • Multi-channel KitDual Channel Kit
  • ChipsetOther

Capacity 16GB 6400Mhz

  • 16 GB DDR5 at 6400 MHz for faster workloads
  • CL46 latency with 46-45-45-90 timings for responsive performance
  • 25 V operation keeps power draw low
  • Aluminium heatsink and 8-layer PCB dissipate heat effectively
  • On-die ECC plus Micron chips protect data integrity

Capacity & Audience

This GUDGA kit provides 16 GB of DDR5 desktop memory rated at 6400 MHz with CL46 latency and 1.25 V operation. It targets enthusiasts and professionals who need high bandwidth for gaming, 4K or 8K editing, 3D rendering and AI workloads.

Upgrade Path

The modules replace standard DDR4 kits and deliver up to 35 percent more speed, while the dual-channel layout and 8-layer PCB maximise throughput for memory-intensive tasks. The jump makes sense when your current platform supports DDR5 and you require the extra headroom for heavy multitasking.

Sustained Load Behaviour

An aluminum heatsink and on-die ECC keep error rates low and temperatures stable during long rendering or compute sessions. Premium Micron chips and the low 1.1 V baseline voltage help maintain consistent throughput without thermal throttling over extended periods.

Poudarki

  • 16 GB DDR5 at 6400 MHz for faster workloads
  • CL46 latency with 46-45-45-90 timings for responsive performance
  • 25 V operation keeps power draw low
  • Aluminium heatsink and 8-layer PCB dissipate heat effectively
  • On-die ECC plus Micron chips protect data integrity

Specifikacije

Capacity8GB
SpeedOther
CAS LatencyCL40
Timing40-40-40-77
Multi-channel KitDual Channel Kit
ChipsetOther
Recommend UseDesktop

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Vprašanja o tem izdelku

Will the 16GB DDR5 module with its aluminum heatsink fit under a standard CPU air cooler?

The module uses a low-profile aluminum heatsink designed for desktop DIMM slots; most tower coolers clear it, but measure your cooler’s DIMM clearance against the heatsink height before installing.

What is the correct BIOS step to run this kit at 6400MHz CL46 instead of the default 4800MHz?

Enable the EXPO or XMP profile in BIOS after seating both sticks in the same-channel slots (usually A2 and B2), save, and reboot — skipping the profile leaves the kit at 4800MHz CL40.

How do I know when the on-die ECC or heatsink performance is degrading after heavy 4K rendering loads?

Watch for new correctable errors in Windows Reliability Monitor or unexpected throttling; if errors rise or temperatures stay high despite case airflow, reseat the modules and clean the heatsink fins.

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