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Spremljani izdelki Prijava
Four green DDR5 RDIMM modules with black chips, no heat spreaders

NEMIX RAM

NEMIX RAM 384GB (4x96GB) DDR5-6400 CL52 1.1V 2Rx4 ECC Registered RDIMM for Supermicro X14SDW-42C-SP9F

SKU CH-N0DQ-SNKBK

A 384 GB DDR5 server memory kit with four 96 GB registered ECC modules at 6400 MT/s, CL52, 1.1 V, validated for the Supermicro X14SDW-42C-SP9F

  • Capacity384GB (4 x 96GB)
  • Type288-Pin DDR5 RDIMM
  • SpeedDDR5 6400 (PC5 51200)
  • CAS LatencyCL52
  • Voltage1.10V
  • ECCYes

Size 384GB 4X96GB

  • 384 GB capacity across four 96 GB modules for maximum server density
  • DDR5-6400 speed with CL52 latency delivers rated throughput for Supermicro X14SDW-42C-SP9F
  • Registered ECC architecture corrects single-bit errors and stabilises fully populated slots
  • 1 V operation at 2Rx4 rank matches the board's memory-controller requirements exactly
  • 288-pin RDIMM form factor fits the motherboard's DDR5 slots without adapters

Exact-match server upgrade

This 384 GB kit contains four 96 GB DDR5-6400 RDIMMs built to the precise rank, voltage and timing the Supermicro X14SDW-42C-SP9F memory controller expects. Registered ECC architecture offloads the controller so every slot runs fully populated at rated speed while correcting single-bit errors on the fly. The 288-pin Registered form factor matches the board's physical and electrical requirements exactly.

Thermals and power

Modules operate at 1.1 V without heat spreaders, relying on the server chassis airflow for cooling. Registered buffering reduces electrical load on the memory controller, helping keep system power draw predictable when all four slots are populated. CL52 latency and PC5-51200 bandwidth are maintained at the standard JEDEC voltage, so no extra voltage headroom is required.

Build integration

The kit plugs directly into the motherboard's 288-pin RDIMM slots following the population order in the system manual. No additional cables, brackets or software configuration are needed beyond standard BIOS memory training. Buyers who need a different capacity, a UDIMM form factor or non-ECC modules should look elsewhere because this kit is validated only for the listed Supermicro platform.

Poudarki

  • 384 GB capacity across four 96 GB modules for maximum server density
  • DDR5-6400 speed with CL52 latency delivers rated throughput for Supermicro X14SDW-42C-SP9F
  • Registered ECC architecture corrects single-bit errors and stabilises fully populated slots
  • 1 V operation at 2Rx4 rank matches the board's memory-controller requirements exactly
  • 288-pin RDIMM form factor fits the motherboard's DDR5 slots without adapters

Specifikacije

BrandNEMIX RAM
SeriesNEMIX RAM Original Series Server Memory
ModelDDR5 ECC RDIMM Registered Server Memory
Part NumberMR51200-9624K4
Capacity384GB (4 x 96GB)
Type288-Pin DDR5 RDIMM
SpeedDDR5 6400 (PC5 51200)
CAS LatencyCL52
Voltage1.10V
ECCYes
Buffered/RegisteredRegistered
Rank2Rx4
ChipsetMajor OEM Samsung, Micron, Hynix
Heat SpreaderNo
Compatible SystemSupermicro
FeaturesDDR5 ECC RDIMM Motherboard Compatible
Package Content384GB 4X96GB DDR5 6400MHz PC5-51200 2Rx4 1.1V 288-PIN ECC RDIMM KIT

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Vprašanja o tem izdelku

How do I install the 288-pin RDIMM kit in the Supermicro X14SDW-42C-SP9F?

Power down, open the chassis, and insert each 96GB module into the slots specified by the motherboard manual for four-DIMM population; the registered buffer and 2Rx4 rank layout must match the board's validated configuration or the system will not POST at the rated 6400 speed.

What maintenance will the 384GB DDR5 ECC RDIMM kit need later?

No routine hardware maintenance is required; ECC corrects single-bit errors automatically, but if a module develops uncorrectable errors the server will log the failure and the affected 96GB stick must be replaced to restore full 384GB capacity.

What limit appears first when the 4x96GB kit runs sustained workloads at 6400 MT/s?

The registered buffer and 1.10V operation keep signal integrity stable, so the first practical ceiling is the motherboard's maximum supported memory capacity and thermal envelope rather than the modules' own timing or voltage headroom.

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