BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
- Rackmount
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NEMIX RAM
A 192GB kit of twelve 16GB DDR5-5600 ECC registered RDIMMs at CL46 and 1.1V, validated for the Supermicro H13DSG-O-CPU motherboard
This NEMIX RAM kit delivers 192GB through twelve 16GB DDR5-5600 registered ECC modules. Each DIMM runs at 1.1V with CL46 latency and a 1Rx8 organisation. The 288-pin RDIMM form factor matches the Supermicro H13DSG-O-CPU motherboard requirements exactly. It is built for servers that need maximum registered capacity.
This kit is intended for administrators upgrading a Supermicro H13DSG-O-CPU to its full 192GB registered ECC limit. Builders using consumer UDIMMs, SODIMMs, or non-ECC memory cannot use these modules. Systems that require a different DDR generation or lower voltage should look elsewhere. The registered buffer and ECC are mandatory for this platform.
The single specification that decides fitment is the twelve-module 1Rx8 registered ECC configuration at 1.1V. The motherboard's memory controller expects this exact rank structure and voltage to recognise full capacity at DDR5-5600. Any deviation in rank count, voltage, or buffer type will prevent the system from booting at the rated speed.
| Brand | NEMIX RAM |
|---|---|
| Series | NEMIX RAM Original Series Server Memory |
| Model | DDR5 ECC RDIMM Registered Server Memory |
| Part Number | MR44800-618K12 |
| Capacity | 192GB (12 x 16GB) |
| Type | 288-Pin DDR5 RDIMM |
| Speed | DDR5 5600 (PC5 44800) |
| CAS Latency | CL46 |
| Voltage | 1.10V |
| ECC | Yes |
| Buffered/Registered | Registered |
| Rank | 1Rx8 |
| Chipset | Major OEM Samsung, Micron, Hynix |
| Heat Spreader | No |
| Compatible System | Supermicro |
| Features | DDR5 ECC RDIMM Motherboard Compatible |
| Package Content | 192GB 12X16GB DDR5 5600MHz PC5-44800 1Rx8 1.1V 288-PIN ECC RDIMM KIT |
The RDIMM modules are a fixed hardware upgrade with no firmware; once seated in the 288-pin slots they remain in place unless the server is physically moved or the memory configuration is changed.
The memory controller on the Supermicro H13DSG-O-CPU is the first bottleneck; the 1Rx8 registered DIMMs deliver their rated 5600 MT/s throughput until the controller or CPU thermal envelope caps sustained bandwidth.
Each 16 GB RDIMM operates at 1.1 V without a heat spreader, so total power draw stays low and the modules rely on normal chassis airflow rather than active cooling.
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