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Spremljani izdelki Prijava
Green circuit board with black graphene heatsink and thermal pad, M.2 2280 form factor

Orico

Orico e3500-1TB 512GB M.2 2280 NVMe internal SSD

SKU CH-MKJ5-0PPW4 MPN e3500-1TB

M.2 2280 internal SSD with PCIe NVMe Gen3 x4 interface, 512 GB 3D NAND, read speeds up to 3600 MB/s and write speeds up to 2800 MB/s, includes graphene cooling vest and thermal pad

  • Device TypeInternal Solid State Drive (SSD)
  • Form FactorM.2 2280
  • Capacity512GB
  • Memory Components3D NAND
  • InterfacePCIe NVMe Gen3 x4
  • Features1. High-performance NVMe SSD with read speeds up to 3100 MB/

Options Graphene Cooling-512GB

  • Fast boot times with read speeds up to 3600 MB/s
  • Cooler operation using the included heatsink and thermal pad
  • Reliable storage backed by 96 hours of testing
  • Data protection through power-loss safeguards and error correction
  • Ready for desktops and laptops with M.2 2280 NVMe slot

Orico J10 512GB NVMe SSD

The Orico J10 is a 512GB internal solid-state drive built on an M.2 2280 form factor with a PCIe NVMe Gen3 x4 interface. It uses 3D NAND flash and targets users upgrading a desktop, laptop or ultrabook that accepts this slot and protocol. Sequential reads reach up to 3100 MB/s and writes up to 1900 MB/s. The drive supports SMART, NCQ, Trim and advanced power management.

Graphene cooling vest and thermal pad

A cooling vest and a thermal conductive silicone pad ship in the box and attach directly to the controller and NAND packages. They spread heat without any moving parts, keeping sustained throughput stable during long writes or heavy multitasking. No extra screws or adhesive are required beyond what the vest provides. The user manual illustrates the single-step installation.

Check M.2 key and PCIe generation before ordering

Verify that your motherboard or laptop exposes an M.2 2280 slot keyed for NVMe PCIe Gen3 x4 operation; a SATA-only or Gen2 slot will limit speed or prevent detection. The drive arrives unallocated and without partitions, so the operating system must initialise and format it on first boot. Allow for the normal 5 to 7 percent capacity difference between labelled and usable space.

Poudarki

  • Fast boot times with read speeds up to 3600 MB/s
  • Cooler operation using the included heatsink and thermal pad
  • Reliable storage backed by 96 hours of testing
  • Data protection through power-loss safeguards and error correction
  • Ready for desktops and laptops with M.2 2280 NVMe slot

Specifikacije

BrandORICO
SeriesORICO J10
ModelORICO J10
Device TypeInternal Solid State Drive (SSD)
Form FactorM.2 2280
Capacity512GB
Memory Components3D NAND
InterfacePCIe NVMe Gen3 x4
Features1. High-performance NVMe SSD with read speeds up to 3100 MB/s and write speeds up to 1900 MB/s, utilizing PCIe Gen3 x4 technology.
2. Ensured reliability and stability through 96 hours of rigorous testing, including sleep tests, read/write tests, high-temperature tests, and performance tests.
3. Compatible with PS5, PCs, and laptops, featuring M.2 2280 form factor and S.M.A.R.T. function support for efficient operation.
4. Equipped with a pre-installed aluminum heatspreader to dissipate heat and prevent throttling, ensuring sustained high performance.
5. Backed by a 5-year limited wa
Package Content1 x ORICO NVMe SSD
1 x Cooling vest
1 x Thermal conductive silicone pad
1 x User manual

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Vprašanja o tem izdelku

Will the included graphene cooling vest and thermal pad need replacement over time?

The cooling vest and thermal pad are passive components with no moving parts and are designed to last the lifetime of the drive under normal operating conditions.

At what point does the PCIe Gen3 x4 interface limit sustained transfer speeds?

The interface caps sequential throughput at the drive's rated 3100 MB/s read and 1900 MB/s write, which is the primary limit during large, sustained data transfers.

How much heat and power does the drive produce during all-day operation?

The 3D NAND QLC flash and PCIe Gen3 x4 controller run cool enough that the supplied heatsink and thermal pad manage temperatures without active cooling or high power draw.

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