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Spremljani izdelki Prijava
Green rectangular laptop memory module with gold edge connector and black chips

SAMSUNG

SAMSUNG M471A4G43AB1-CWE 32GB DDR4 3200 laptop RAM

SKU CH-XZYB-QE6NW

32GB DDR4 3200 SODIMM laptop memory module with CL22 latency and 1.2V operation

  • Capacity32GB
  • Type260-Pin DDR4 SO-DIMM
  • SpeedDDR4 3200 (PC4 25600)
  • CAS LatencyCL22
  • Voltage1.20V
  • ECCNo
  • 32 GB capacity handles heavy multitasking with ease
  • DDR4 3200 speed delivers fast data transfer rates
  • Low 1.2 V operation reduces power consumption
  • 260-pin SODIMM form factor fits standard laptop slots
  • CL22 latency supports responsive system performance

32GB DDR4 3200 SODIMM

This 32GB DDR4 3200 SODIMM module adds a single large-capacity stick to a compatible laptop. It runs at 1.20V with CL22 latency and uses a 260-pin unbuffered layout without a heat spreader. The component composition is (2G x 8) x 16 chips in the Rev D revision.

Buyers who need more than 32GB in one slot

This module suits owners of laptops that accept a single 32GB DDR4 3200 SODIMM at 1.20V. Buyers whose systems cap memory at 16GB per slot or require a different DDR generation should look at something else. ECC and registered memory are not supported by this part.

Single 32GB capacity per slot

The decisive specification is the 32GB density on one 260-pin SODIMM. If the laptop documentation lists a maximum of 16GB per slot, this module will not work. Verify the per-slot limit before ordering.

Poudarki

  • 32 GB capacity handles heavy multitasking with ease
  • DDR4 3200 speed delivers fast data transfer rates
  • Low 1.2 V operation reduces power consumption
  • 260-pin SODIMM form factor fits standard laptop slots
  • CL22 latency supports responsive system performance

Specifikacije

BrandSAMSUNG
ModelM471A4G43AB1-CWE
Capacity32GB
Type260-Pin DDR4 SO-DIMM
SpeedDDR4 3200 (PC4 25600)
CAS LatencyCL22
Voltage1.20V
ECCNo
Buffered/RegisteredUnbuffered / Unregistered
Heat SpreaderNo

Vprašanja o tem izdelku

Will the CL22 latency become the bottleneck during sustained heavy workloads?

CL22 is the rated timing at 3200 Mbps; the module runs at 1.20 V without a heat spreader, so latency remains constant while the system manages thermals.

How much heat and power does a 1.20 V 32 GB module produce when running all day?

At 1.20 V the module draws minimal power and generates little heat; it has no heat spreader, so case airflow handles cooling during continuous operation.

Does my laptop need a 260-pin DDR4 SO-DIMM slot that accepts 2Rx8 unbuffered modules?

Yes — this is a 260-pin DDR4 SO-DIMM, 2Rx8, unbuffered, non-ECC at 1.20 V; the slot and chipset must support 32 GB density at 3200 Mbps.

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