BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
- Rackmount
Sprejemamo kriptovalute — tako lahko sredstva, ki jih imate, kupijo pravo strojno opremo.Plačajte v kriptovaluti, zapravite jo za pravo strojno opremo. Brezplačna zavarovana dostava po vsem svetu nad 399 $. Nevtralni kartoni brez znamke, poslani iz Nemčije.Brezplačna zavarovana dostava nad 399 $. Vaš tečaj je zaklenjen za 30 minut, takoj ko se odpre blagajna.Tečaj zaklenjen 30 minut. Vsak izdelek je zapečaten, njegova serijska številka preverjena, in krit z 24-mesečno garancijo.Zapečateno, 24-mesečna garancija.
WMtec
M-ATX server board with Intel B660 chipset, LGA 1700 socket, dual-channel DDR4 up to 64 GB, four SATA 3.0 ports, one PCIe 4.0/5.0 x16 slot, two M.2 22110 NVME slots, and 8-phase power delivery
This WMtec B660 D4 board fits the LGA 1700 socket in a 235 by 195 millimetre M-ATX layout. It targets builders assembling a compact server or workstation that needs dual-channel DDR4 memory and multiple high-speed storage options. The eight-phase power delivery and four-layer PCB aim at stable operation under sustained loads.
The two DDR4 slots accept up to 64 gigabytes at speeds up to 3200 megahertz depending on the installed processor. One PCI Express 4.0 or 5.0 x16 slot and one PCI Express 3.0 x4 slot handle add-in cards. Builders needing four memory channels, dual-processor support or more than two M.2 drives should choose a different platform.
Maximum capacity is 64 gigabytes across two slots running at 2400, 2666, 2933 or 3200 megahertz with XMP support. Four SATA 3.0 ports and two M.2 22110 NVME interfaces provide storage connectivity. Rear I/O includes four USB 3.0 ports, two USB 2.0 ports, VGA, HDMI, DisplayPort, gigabit Ethernet and three analogue audio jacks driven by the ALC897 codec.
| CPU Type | Dual Intel Xeon |
|---|
Align the processor notches with the socket keys, lower it gently, close the retention lever fully, then connect the 8-pin CPU power cable — the extra power connector is the step most builders forget.
Dust the four-layer PCB and the eight-phase VRM heatsinks every few months; the only replaceable part is the BIOS coin cell, which should be swapped when the clock drifts after power-off.
The eight-phase power delivery and four-layer PCB set the thermal ceiling, so VRM throttling will arrive before the dual-channel DDR4 3200 bandwidth or the PCIe 4.0 x16 slot saturate.
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