UPSIREN OEM Thermal Pad 21W/mK 100x100x3.0mm 23g

High-conductivity silicone thermal pad

This UPSIREN OEM pad measures 100 by 100 by 3.0 millimetres and weighs 23 grams. It carries a rated thermal conductivity of 21 W/mK and a long-term operating range of minus 40 to 200 degrees Celsius. The silicone material is non-conductive, non-corrosive, non-curing and non-toxic. Natural viscosity lets it seat easily and be reused.

Builders filling larger gaps on GPUs.

The 3.0 millimetre thickness suits interfaces where a standard paste layer is too thin and a thinner pad leaves voids. Users needing a sub-millimetre bond line or a liquid metal compound should choose a different format. The pad’s 30-degree shore hardness gives a soft, compressible feel that conforms to uneven surfaces without excessive pressure.

Steady heat transfer across the full temperature

Rated conductivity holds from minus 40 up to 200 degrees Celsius without melting or curing, so sustained loads do not degrade the interface. Non-curing silicone avoids pump-out over thermal cycles, keeping contact pressure stable. Electrical insulation remains intact at high temperature, preventing shorts on exposed PCB traces.